參數(shù)資料
型號(hào)： DS5002FP
英文描述： Secure Microprocessor Chip
中文描述： 安全微處理器芯片
文件頁(yè)數(shù)： 19/25頁(yè)
文件大?。?/td> 445K
代理商： DS5002FP
DS5002FP Secure Microprocessor Chip
19 of 25
Table 1. Serial Bootstrap Loader Commands
COMMAND
C
Return CRC-16 of the program/data NV RAM
D
Dump Intel Hex file
F
Fill program/data NV RAM
G
Get data from P1, P2, and P3
I
N/A on the DS5002FP
L
Load Intel Hex file
M
Toggle modem available bit
N
Set freshness seal—all program and data is lost
P
Put data into P0, P1, P2, and P3
R
Read status of NV SFRs (MCON, RPCTL, MSL, CALIB)
T
Trace (echo) incoming Intel Hex code
U
Clear Security Lock
V
Verify program/data NV RAM with incoming Intel Hex data
W
Write special function registers (MCON, RPCTL, MSL, CALIB)
Z
Set security lock
Execution of certain bootstrap loader commands result in the loading of the newly generated 64-bit random number
into the encryption key word. These commands are as follows:
Fill
F
Load
L
Dump D
Verify V
CRC
C
Execution of the Fill and Load commands result in the data loaded into the NV RAM in an encrypted form
determined by the value of the newly generated key word. The subsequent execution of the Dump command
within
the same bootstrap session
causes the contents of the encrypted RAM to be read out and transmitted back to the
host PC in decrypted form. Similarly, execution of the Verify command
within the same bootstrap session
causes
the incoming absolute hex data to be compared against the true contents of the encrypted RAM, and the CRC
command returns the CRC value calculated from the true contents of the encrypted RAM. As long as any of the
above commands are executed
within the same bootstrap session
, the loaded key value remains the same, and
the contents of the encrypted program/data NV RAM can be read or written normally and freely until the security
lock bit is set.
When the security lock bit is set using the Z command, no further access to the true RAM contents is possible
using any bootstrap command or by any other means.
INSTRUCTION SET
The DS5002FP executes an instruction set that is object code-compatible with the industry standard 8051
microcontroller. As a result, software development packages such as assemblers and compilers that have been
written for the 8051 are compatible with the DS5002FP. A complete description of the instruction set and operation
are provided in the
Secure Microcontroller User’s Guide
.
Also note that the DS5002FP is embodied in the DS2252T module. The DS2252T combines the DS5002FP with
between 32k and 128k of SRAM, a lithium cell, and a real-time clock. This is packaged in a 40-pin SIMM module.
MEMORY ORGANIZATION
Figure 10
illustrates the memory map accessed by the DS5002FP. The entire 64k of program and 64k of data are
potentially available to the byte-wide bus. This preserves the I/O ports for application use. The user controls the
portion of memory that is actually mapped to the byte-wide bus by selecting the program range and data range.
Any area not mapped into the NV RAM is reached by the expanded bus on ports 0 and 2. An alternate
configuration allows dynamic partitioning of a 64k space as shown in
Figure 11
. Selecting PES = 1 provides
another 64k of potential data storage or memory mapped peripheral space as shown in
Figure 12
. These
FUNCTION
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS5002FP/C01 功能描述:微處理器 - MPU RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
DS5002FP_06 制造商:DALLAS 制造商全稱(chēng):Dallas Semiconductor 功能描述:Secure Microprocessor Chip
DS5002FP_1 制造商:DALLAS 制造商全稱(chēng):Dallas Semiconductor 功能描述:Secure Microprocessor Chip
DS5002FP08 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:Microcontroller
DS5002FP-12 功能描述:微處理器 - MPU RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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