Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely" />
參數(shù)資料
型號(hào)： DS3253N+
廠商： Maxim Integrated Products
文件頁數(shù)： 69/71頁
文件大?。?/td> 0K
描述： IC LIU DS3/E3/STS-1 144-CSBGA
產(chǎn)品培訓(xùn)模塊： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝： 160
類型： 線路接口裝置（LIU）
驅(qū)動(dòng)器/接收器數(shù)： 3/3
規(guī)程： IEEE 1149.1
電源電壓： 3.135 V ~ 3.465 V
安裝類型： 表面貼裝
封裝/外殼： 144-BGA，CSPBGA
供應(yīng)商設(shè)備封裝： 144-TECSBGA（13x13）
包裝： 托盤
DS3251/DS3252/DS3253/DS3254
71 of 71
Maxim/Dallas Semiconductor cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim/Dallas Semiconductor product.
No circuit patent licenses are implied. Maxim/Dallas Semiconductor reserves the right to change the circuitry and specifications without notice at any time.
Ma x i m In tegra t ed P roduc ts , 1 2 0 S a n Ga brie l D r iv e , Sun n y vale , CA 94 086 40 8 -7 3 7 -76 00
2006 Maxim Integrated Products
Printed USA
The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation.
20.
THERMAL INFORMATION
Table 20-A. Thermal Properties, Natural Convection
PARAMETER
MIN
TYP
MAX
Ambient Temperature (Note 1)
-40
°C
—
+85
°C
Junction Temperature
-40
°C
—
+125
°C
Theta-JA (
θJA), Still Air (Note 2)
22.4
°C/W
Psi-JB
9.2
°C/W
Psi-JT
1.6
°C/W
Note 1:
The package is mounted on a four-layer JEDEC standard test board with no airflow and dissipating maximum power.
Note 2:
Theta-JA (
θJA) is the junction to ambient thermal resistance, when the package is mounted on a four-layer JEDEC standard test board
with no airflow and dissipating maximum power.
Table 20-B. Theta-JA (
θJA) vs. Airflow
FORCED AIR (METERS PER
SECOND)
THETA-JA (
θJA)
0
22.4
°C/W
1
19.0
°C/W
2.5
17.2
°C/W
21.
REVISION HISTORY
REVISION
DESCRIPTION
031805
New Product Release (DS3254)
061705
New Product Release (DS3251/DS3252/DS3253)
030106
Added requirement that ALE pin must be high when using the SPI interface: Figure 4-1 (at the
bottom), the second paragraph of Section 5, Table 6-F, the first paragraph of Section 15.2,
Table 18-A, Figure 18-3, Figure 18-6, Figure 18-9, and Figure 18-12.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS3253N# 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Triple DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3253N+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Triple DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3253NA3 制造商:Maxim Integrated Products 功能描述:DS3253 REV A3 - Rail/Tube
DS3254 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3254+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3/STS-1 Line Interface Unit RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
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