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參數(shù)資料
| 型號(hào)： | DS21Q554BN+ |
| 廠商： | Maxim Integrated Products |
| 文件頁(yè)數(shù)： | 4/13頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | TXRX QUAD T1/E1 3.3/5.0V 256BGA |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 功能： | 收發(fā)器 |
| 接口： | E1 |
| 電路數(shù)： | 4 |
| 電源電壓： | 5V |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 256-BBGA |
| 供應(yīng)商設(shè)備封裝： | 256-BGA（27x27） |
| 包裝： | 管件 |
| 包括： | 警報(bào)檢測(cè)和生成，通道控制，調(diào)幀器，HDLC 控制器 |
| 其它名稱： | 90-21Q55+4BN |
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DALLAS SEMICONDUCTOR
DS21Q352/DS21Q552/DS21Q354/DS21Q554 Preliminary Data Sheet
December 29, 1998
12
POWER SUPPLY DE-COUPLING
In a typical PCB layout for the DS21x5y, all of the VDD pins will connect to a common power plane and all
the VSS lines will connect to a common ground plane. There are three recommended methods for de-
coupling shown below in both schematic and pictorial form. As shown in the pictorials, the capacitors
should be symmetrically located about the device. The first shown in figure 3 uses standard capacitors,
two 33uf tantalums, two .33uf ceramics and two .01uf ceramics. The second method shown in figure 4
uses a single 68uf tantalum, two .33uf ceramics and two .01uf ceramics. The third method shown in figure
5 uses only four capacitors, two 1.5uf MLC and two .01uf ceramics. The 1.5uf is an MLC (Multi Layer
Ceramic) type. The MLC construction is a low inductance type, which allows a smaller value of
capacitance to be used. Since VDD and VSS signals will typically pass vertically to the power and ground
planes of a PCB, the de-coupling caps must be placed as close to the DS21Qx5y as possible and routed
vertically to power and ground planes.
De-coupling scheme using standard tantalum caps. Figure 3
De-coupling scheme using single 68uf cap. Figure 4
De-coupling scheme using MCL caps. Figure 5
All capacitor values in figures 3, 4 and 5 are in uf.
33
.33
.01
33
.33
.01
VDD
DS21Qx5y
.01
.33
33
DS21Qx5y
.01
VDD
DS21Qx5y
1.5
.01
1.5
DS21Qx5y
.33
.01
.33
VDD
DS21Qx5y
68
.01
.33
68
DS21Qx5y
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS21Q554BN+ | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q554BW | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q554N | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q554N+ | 制造商:Maxim Integrated Products 功能描述:QUAD T1/E1 TRANSCEIVER (3.3V, 5.0V) - Rail/Tube |
| DS21Q55DK | 功能描述:網(wǎng)絡(luò)開(kāi)發(fā)工具 RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類(lèi)型:Ethernet to Wi-Fi Bridges 工具用于評(píng)估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類(lèi)型:802.11 b/g, Ethernet 工作電源電壓:3.3 V |
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