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參數(shù)資料
| 型號： | DS21Q552BN+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 4/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC TXRX T1 QUAD 5V 256BGA |
| 產(chǎn)品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 40 |
| 功能： | 收發(fā)器 |
| 接口： | T1 |
| 電路數(shù)： | 4 |
| 電源電壓： | 5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 256-BBGA |
| 供應商設備封裝： | 256-BGA（27x27） |
| 包裝： | 管件 |
| 包括： | 警報檢測和生成，通道控制，調(diào)幀器，HDLC 控制器 |
DALLAS SEMICONDUCTOR
DS21Q352/DS21Q552/DS21Q354/DS21Q554 Preliminary Data Sheet
December 29, 1998
12
POWER SUPPLY DE-COUPLING
In a typical PCB layout for the DS21x5y, all of the VDD pins will connect to a common power plane and all
the VSS lines will connect to a common ground plane. There are three recommended methods for de-
coupling shown below in both schematic and pictorial form. As shown in the pictorials, the capacitors
should be symmetrically located about the device. The first shown in figure 3 uses standard capacitors,
two 33uf tantalums, two .33uf ceramics and two .01uf ceramics. The second method shown in figure 4
uses a single 68uf tantalum, two .33uf ceramics and two .01uf ceramics. The third method shown in figure
5 uses only four capacitors, two 1.5uf MLC and two .01uf ceramics. The 1.5uf is an MLC (Multi Layer
Ceramic) type. The MLC construction is a low inductance type, which allows a smaller value of
capacitance to be used. Since VDD and VSS signals will typically pass vertically to the power and ground
planes of a PCB, the de-coupling caps must be placed as close to the DS21Qx5y as possible and routed
vertically to power and ground planes.
De-coupling scheme using standard tantalum caps. Figure 3
De-coupling scheme using single 68uf cap. Figure 4
De-coupling scheme using MCL caps. Figure 5
All capacitor values in figures 3, 4 and 5 are in uf.
33
.33
.01
33
.33
.01
VDD
DS21Qx5y
.01
.33
33
DS21Qx5y
.01
VDD
DS21Qx5y
1.5
.01
1.5
DS21Qx5y
.33
.01
.33
VDD
DS21Qx5y
68
.01
.33
68
DS21Qx5y
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| DS21Q552BN+ | 功能描述:網(wǎng)絡控制器與處理器 IC 5V Quad T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q552N | 功能描述:網(wǎng)絡控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q552N+ | 功能描述:網(wǎng)絡控制器與處理器 IC 5V Quad T1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS21Q552N-C01 | 制造商:Maxim Integrated Products 功能描述:DS21Q552 RCV LVL SCR - Rail/Tube |
| DS21Q554 | 功能描述:網(wǎng)絡控制器與處理器 IC Quad E1 Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
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