參數(shù)資料
型號: DS21354LB+
廠商: Maxim Integrated Products
文件頁數(shù): 123/124頁
文件大小: 0K
描述: IC TXRX E1 3.3V 100-LQFP
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 90
功能: 單芯片收發(fā)器
接口: E1,HDLC
電路數(shù): 1
電源電壓: 3.14 V ~ 3.47 V
電流 - 電源: 75mA
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 100-LQFP
供應(yīng)商設(shè)備封裝: 100-LQFP(14x14)
包裝: 托盤
包括: 遠(yuǎn)程和 AIS 警報檢測器 / 發(fā)生器
產(chǎn)品目錄頁面: 1430 (CN2011-ZH PDF)
DS21354/DS21554 3.3V/5V E1 Single-Chip Transceivers
98 of 124
17.
INTERLEAVED PCM BUS OPERATION
In many architectures, the outputs of individual framers are combined into higher speed serial buses to
simplify transport across the system. The DS21354/DS21554 can be configured to allow data and
signaling buses to be multiplexed into higher speed data and signaling buses eliminating external
hardware saving board space and cost.
The interleaved PCM bus option (IBO) supports two bus speeds. The 4.096 MHz bus speed allows two
SCTs to share a common bus. The 8.192MHz bus speed allows four SCTs to share a common bus. See
Figure 17-1 for an example of four devices sharing a common 8.192MHz PCM bus. Each SCT that shares
a common bus must be configured through software and requires the use of one or two device pins. The
elastic stores of each SCT must be enabled and configured for 2.048MHz operation. See Figure 17-1 and
For all bus configurations, one SCT will be configured as the master device and the remaining SCTs will
be configured as slave devices. In the 4.096MHz bus configuration there is one master and one slave. In
the 8.192MHz bus configuration there is one master and three slaves. Refer to the IBO register
description for more detail.
IBO: INTERLEAVE BUS OPERATION REGISTER (Address = B5 Hex)
(MSB)
(LSB)
IBOEN
INTSEL
MSEL0
MSEL1
SYMBOL
POSITION
NAME AND DESCRIPTION
IBO.6
Not Assigned. Should be set to 0.
IBO.6
Not Assigned. Should be set to 0.
IBO.5
Not Assigned. Should be set to 0.
IBO.4
Not Assigned. Should be set to 0.
IBOEN
IBO.3
Interleave Bus Operation Enable
0 = Interleave Bus Operation disabled.
1 = Interleave Bus Operation enabled.
INTSEL
IBO.2
Interleave Type Select
0 = Byte interleave.
1 = Frame interleave.
MSEL0
IBO.1
Master Device Bus Select Bit 0. See Table 17-1.
MSEL1
IBO.0
Master Device Bus Select Bit 1. See Table 17-1.
Table 17-1. IBO Master Device Select
MSEL1
MSEL0
FUNCTION
0
Slave device.
0
1
Master device with 1 slave device (4.096MHz bus rate)
1
0
Master device with 3 slave devices (8.192MHz bus rate)
1
Reserved
相關(guān)PDF資料
PDF描述
DS21554LN+ IC TXRX E1 1-CHIP 5V 100-LQFP
DS21352LN+ IC TXRX T1 1-CHIP 3.3V 100-LQFP
DS2156L+ IC TXRX T1/E1/J1 1-CHIP 100-LQFP
DS2155LC2+ IC TXRX T1/E1/J1 SGL 100-LQFP
DS26504L+ IC T1/E1/J1 64KCC ELEMENT 64LQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS21354LB+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V E1 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21354LC1 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V E1 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21354LC1+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V E1 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21354LN 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V E1 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS21354LN+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3.3/5V E1 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray