DS1629
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ABSOLUTE MAXIMUM RATINGS
Voltage Range on V
DD
, Relative to Ground (Note 1)
-0.3V to +6.0V
Voltage Range on Any Other Pin, Relative to Ground
-0.3V to (V
DD
+ 0.3V)
Continuous Power Dissipation (T
A
= +70癈)
SO (derate 7.80mW/癈 above +70癈)
623.10mW
Operating Temperature Range
-55癈 to +125癈
Storage Temperature Range
-55癈 to +125癈
Lead Temperature (soldering, 10s)
+300癈
Soldering Temperature (reflow)
+260癈
Note 1: All voltages are referenced to ground, unless otherwise noted.
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect device
reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
SO
Junction-to-Ambient Thermal Resistance (?/DIV>
JA
)
128.40癈/W
Junction-to-Case Thermal Resistance (?/DIV>
JC
)
36癈/W
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification
JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
RECOMMENDED DC OPERATING CONDITIONS
(2.2V d V
DD
d 5.5V, T
A
= -55癈 to +125癈, unless otherwise noted.)
PARAMETER
SYMBOL    CONDITION    MIN     TYP     MAX     UNITS    NOTES
Su   l   Volta  e
V   
2.2
5.5
V
1 11
DC ELECTRICAL CHARACTERISTICS
(2.2V d V
DD
d 5.5V, T
A
= -55癈 to +125癈, unless otherwise noted.)
PARAMETER
YMB  L
DITI
MI
TYP
MAX
IT
TE
L   i    In
-
Logic 1 Input
V
IH
0.7V
DD
V
DD
+
0.5
V
Logic 0 Output (SDA,
ALRM OSC
V
OL
0
0.4
V
3
Input Current
Each I/O Pin
0.4 < V
I/O
<
0.9V   
-10
+10
礎(chǔ)
4
Standby Current
I
DDS
V   = 2.2V
0.1
礎(chǔ)
5
=
2
Timekeeping Current
I
DDC
V
DD
= 2.2V
0.8
礎(chǔ)
6
V   = 5.0V
1
2-Wire
Communication
I
DD2
= 2 2
1
礎(chǔ)
6
V
DD
= 5.0V
150
Thermometer Current
I
DDT
V   = 2.7V
1100
礎(chǔ)
6
V   = 5.0V
1100
Active Current
I
DD
= 2
11
礎(chǔ)
6
V   = 5.0V
1200