參數(shù)資料
型號(hào): DS1556P-70
廠商: Maxim Integrated Products
文件頁(yè)數(shù): 9/18頁(yè)
文件大小: 0K
描述: IC RTC RAM Y2K 5V 70NS 34-PCM
標(biāo)準(zhǔn)包裝: 40
類(lèi)型: 時(shí)鐘/日歷
特點(diǎn): 警報(bào)器,閏年,NVSRAM,監(jiān)視計(jì)時(shí)器,Y2K
存儲(chǔ)容量: 128KB
時(shí)間格式: HH:MM:SS(24 小時(shí))
數(shù)據(jù)格式: YY-MM-DD-dd
接口: 并聯(lián)
電源電壓: 4.5 V ~ 5.5 V
電壓 - 電源,電池: 3V
工作溫度: 0°C ~ 70°C
安裝類(lèi)型: 表面貼裝
封裝/外殼: 34-PowerCap? 模塊
供應(yīng)商設(shè)備封裝: 34-PowerCap 模塊
包裝: 托盤(pán)
DS1556 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM
17 of 18
AC TEST CONDITIONS
Output Load: 50 pF + 1TTL Gate
Input Pulse Levels:
0.0 to 3.0V
Timing Measurement Reference Levels:
Input: 1.5V
Output: 1.5V
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1. Voltage referenced to ground.
2. Typical values are at +25
C and nominal supplies.
3. Outputs are open.
4. Battery switchover occurs at the lower of either the battery voltage or VPF.
5. The
IRQ/FT and RST outputs are open drain.
6. Data-retention time is at +25
C.
7. Each DS1556 has a built-in switch that disconnects the lithium source until VCC is first applied by the
user. The expected tDR is defined for DIP modules and PowerCap modules as a cumulative time in the
absence of VCC starting from the time power is first applied by the user.
8. RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques
as long as temperature exposure to the lithium energy source contained within does not exceed
+85
C. Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic
vibration is not used.
In addition, for the PowerCap:
a. Maxim recommends that PowerCap Module bases experience one pass through solder reflow
oriented with the label side up (“l(fā)ive-bug”).
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to
remove solder.
9. tAH1, tDH1 are measured from WE going high.
10. tAH2, tDH2 are measured from CE going high.
11. tWC = 200ns.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-”
in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
32 EDIP
MDF32+1
34 PWRCP
PC2+6
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS1556P-70+ 功能描述:實(shí)時(shí)時(shí)鐘 1M NV RAM Timekeeper RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
DS1556P-70IND 功能描述:實(shí)時(shí)時(shí)鐘 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
DS1556P-70IND+ 功能描述:實(shí)時(shí)時(shí)鐘 1M NV RAM Timekeeper RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
DS1556W-120 功能描述:實(shí)時(shí)時(shí)鐘 RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube
DS1556W-120+ 功能描述:實(shí)時(shí)時(shí)鐘 1M NV RAM Timekeeper RoHS:否 制造商:Microchip Technology 功能:Clock, Calendar. Alarm RTC 總線接口:I2C 日期格式:DW:DM:M:Y 時(shí)間格式:HH:MM:SS RTC 存儲(chǔ)容量:64 B 電源電壓-最大:5.5 V 電源電壓-最小:1.8 V 最大工作溫度:+ 85 C 最小工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube