參數(shù)資料
型號(hào): DS1350ABP-70-IND
元件分類: 圓形連接器
英文描述: Circular Connector; MIL SPEC:MIL-C-5015; Body Material:Metal; Series:GTS; No. of Contacts:19; Connector Shell Size:24; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight
中文描述: 4096k非易失SRAM與電池監(jiān)視器
文件頁數(shù): 3/12頁
文件大?。?/td> 228K
代理商: DS1350ABP-70-IND
DS1350Y/AB
3 of 12
FRESHNESS SEAL
Each DS1350 is shipped from Dallas Semiconductor with its lithium energy source disconnected,
guaranteeing full energy capacity. When V
CC
is first applied at a level greater than V
TP
, the lithium
energy source is enabled for battery backup operation.
PACKAGES
The 34-pin PowerCap Module integrates SRAM memory and nonvolatile control along with contacts for
connection to the lithium battery in the DS9034PC PowerCap. The PowerCap Module package design
allows a DS1350 PCM device to be surface mounted without subjecting its lithium backup battery to
destructive high-temperature reflow soldering. After a DS1350 PCM is reflow soldered, a DS9034PC is
snapped on top of the PCM to form a complete Nonvolatile SRAM module. The DS9034PC is keyed to
prevent improper attachment. DS1350 PowerCap Modules and DS9034PC PowerCaps are ordered
separately and shipped in separate containers. See the DS9034PC data sheet for further information.
相關(guān)PDF資料
PDF描述
DS1350AB-100 M39012 MIL RF CONNECTOR
DS1350Y-70 4096k Nonvolatile SRAM with Battery Monitor
DS1350YP-70-IND Isolation Transformer Receive
DS1350AB-70 4096k Nonvolatile SRAM with Battery Monitor
DS1350Y 4096k Nonvolatile SRAM with Battery Monitor
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS1350ABP-70IND+ 功能描述:NVRAM 4096K NV SRAM w/Battery Monitor RoHS:否 制造商:Maxim Integrated 數(shù)據(jù)總線寬度:8 bit 存儲(chǔ)容量:1024 Kbit 組織:128 K x 8 接口類型:Parallel 訪問時(shí)間:70 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 工作電流:85 mA 最大工作溫度:+ 70 C 最小工作溫度:0 C 封裝 / 箱體:EDIP 封裝:Tube
DS1350BL-100 功能描述:IC NVSRAM 4MBIT 100NS 34LPM RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN(2x3) 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF)
DS1350BL-100-IND 制造商:未知廠家 制造商全稱:未知廠家 功能描述:NVRAM (Battery Based)
DS1350BL-70 功能描述:IC NVSRAM 4MBIT 70NS 34LPM RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN(2x3) 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF)
DS1350BL-70IND 功能描述:IC NVSRAM 4MBIT 70NS 34LPM RoHS:否 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN(2x3) 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF)