參數(shù)資料
型號(hào): DRV8800PWPR
廠商: TEXAS INSTRUMENTS INC
元件分類: 運(yùn)動(dòng)控制電子
英文描述: BRUSH DC MOTOR CONTROLLER, 2.8 A, PDSO16
封裝: PLASTIC, HTSSOP-16
文件頁數(shù): 8/27頁
文件大?。?/td> 952K
代理商: DRV8800PWPR
P =I (2
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D
DS(on)Sink
2
SLVS855E – JULY 2008 – REVISED OCTOBER 2010
www.ti.com
Slow-Decay SR (Brake Mode)
In slow-decay mode, both low-side sinking drivers turn on, allowing the current to circulate through the H-bridge’s
low side (two sink drivers) and the load. Power dissipation I2R loses in the two sink DMOS drivers:
(2)
SENSE
A low-value resistor can be placed between the SENSE pin and ground for current-sensing purposes. To
minimize ground-trace IR drops in sensing the output current level, the current-sensing resistor should have an
independent ground return to the star ground point. This trace should be as short as possible. For low-value
sense resistors, the IR drops in the PCB can be significant, and should be taken into account.
NOTE
When selecting a value for the sense resistor, SENSE does not exceed the maximum
voltage of ±500 mV. The H-bridge is disabled and enters recirculation while motor winding
current is above a SENSE voltage equal or greater than 500 mV.
Ground
A ground power plane should be located as close to the DRV8800/DRV8801 as possible. The copper ground
plane directly under the PowerPAD package makes a good location. This pad can then be connected to ground
for this purpose.
Layout
The printed circuit board (PCB) should use a heavy ground plane. For optimum electrical and thermal
performance, the DRV8800/DRV8801 must be soldered directly onto the board. On the underside of the
DRV8800/DRV8801 is a PowerPAD package, which provides a path for enhanced thermal dissipation. The
thermal pad should be soldered directly to an exposed surface on the PCB. Thermal vias are used to transfer
heat to other layers of the PCB. For more information on this technique, please refer to document SLMA002.
The load supply pin, VBB, should be decoupled with an electrolytic capacitor (typically 100 mF) in parallel with a
ceramic capacitor placed as close as possible to the device. The ceramic capacitors between VCP and VBB,
connected to VREG, and between CP1 and CP2 should be as close to the pins of the device as possible, in
order to minimize lead inductance.
16
Copyright 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): DRV8800 DRV8801
相關(guān)PDF資料
PDF描述
DRW16 ROTARY CODED SWITCH-16POSITIONS, HEXADECIMAL, LATCHED, THROUGH HOLE-STRAIGHT
5-1437584-7 ROTARY CODED SWITCH-16POSITIONS, HEXADECIMAL, LATCHED, THROUGH HOLE-STRAIGHT
DS-1177 Power Dividers Space Qualified
DS-1178 Power Dividers Space Qualified
DS-117 Three-Way Power Dividers 1300 MHz
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