參數(shù)資料
型號(hào): DQ7534
英文描述: SMD Shielded Base Plate Power Inductor Series
中文描述: 底板貼片屏蔽功率電感系列
文件頁(yè)數(shù): 3/3頁(yè)
文件大小: 330K
代理商: DQ7534
Item
Specification
Test Method/Condition
Environmental
Static Humidity
After exposure part remains within
specified electrical parameters for
L, Q and DCR.
Storage Life
After exposure part remains within
specified electrical parameters for
L, Q and DCR.
Temperature Cycle
After exposure part remains within
specified electrical parameters for
L, Q and DCR.
10 cycles (Air to Air) 1 cycle shall consist of:
30 minutes exposure to +85°C
30 minutes exposure to -40°C
Allow 20 minutes transition between extremes.
Temperature Shock
After exposure part remains within
specified electrical parameters for
L, Q and DCR.
10 cycles (Air to Air) 1 cycle shall consist of:
30 minutes exposure to -55°C
30 minutes exposure to +125°C
15 seconds maximum transition between temperatures
IR Reflow
5-8 seconds at 240°C max.
Ramped reflow in oven to 240°C +4%-0%. Post test parts shall
pass all electrical specifications after reflow. Parts shall not
show visible signs of solder flow or leakage from the part.
General
Storage Temperature
Range
-40°C to +85°C
Operating Temperature
Range
-40°C to +85°C
Flammability
IEC 695-2-2
Withstands needle-flame test
Other
Vibration
After exposure part remains within
specified electrical parameters for
L, Q and DCR.
1 cycle of 30 minutes of the following:
5 - 7 Hz constant displacement of 0.75 inches, 5 minutes
7 - 30 Hz constant acceleration of 1.5 Gs, 10 minutes
31 - 50 Hz constant displacement of 0.33 inches, 5 minutes
50 - 500 Hz constant acceleration of 1.2 Gs, 10 minutes
Mechanical Shock
After exposure part remains within
specified electrical parameters for
L, Q and DCR.
DQ6530 Series - 500 Gs per axis, 2 directions
DQ6545 Series - 500 Gs per axis, 2 directions
DQ7534 Series - 500 Gs per axis, 2 directions
DQ7545 Series - 500 Gs per axis, 2 directions
DQ1260 Series - 500 Gs per axis, 2 directions
DQ1280 Series - 500 Gs per axis, 2 directions
Solderability
Wetting shall cover 90% minimum of
each termination
Dip pads in RMA
flux, 63/37 solder
(Sn/Pb) at 232°C for
5 seconds ±2
seconds.
Component Adhesion
(Push Test)
Component shall withstand 6 lb. push
force minimum without delaminating
from mounting surface.
Apply and measure force with a digital force gauge set.
Resistance to Solvent
Withstands 6 minutes of alcohol.
Withstands 3 minutes forced spray Freon TMS
Chemical
Ionic Contamination
Conductivity:
pH:
Chlorides:
Sodium:
Potassium:
11 μO(píng)hms/cm maximum
5.5 to 9
65 ppm maximum
20 ppm maximum
10 ppm maximum
Series
Revision
E
Sheet 3 of 3
Subject parts to an environment of 85°C 85% R.H. for 168
hours. After exposure allow parts to dry for 4 hours before
measurements are taken.
Precondition at 25°C for 60 minutes. Expose parts to an
environment of +40°C with 90 to 95% R.H. for 240 hours.
DQ SERIES
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