參數(shù)資料
型號: DPZ128X16IHY-17M
廠商: TWILIGHT TECHNOLOGY INC
元件分類: PROM
英文描述: 128K X 16 FLASH 12V PROM MODULE, 170 ns, QFP48
封裝: HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48
文件頁數(shù): 1/16頁
文件大?。?/td> 1082K
代理商: DPZ128X16IHY-17M
2 Megabit FLASH EEPROM
DPZ128X16IY/IIY/IJY/IHY/IA3
DESCRIPTION:
The DPZ128X16IY/IIY/IJY/IHY/IA3 devices are a
revolutionary new memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers
(SLCC). Available in straight leaded, ‘’J’’ leaded or gullwing
leaded packages, or mounted on a 50-pin PGA co-fired
ceramic substrate. The devices pack 2-Megabits of FLASH
EEPROM in an area as small as 0.463 in2, while maintaining
a total height as low as 0.082 inches.
The DPZ128X16IY/IIY/IJY/IHY/IA3 devices are an individual
SLCC package each containing two 128K x 8 FLASH
memory devices. Each SLCC is hermetically sealed making
the module suitable for commercial, industrial and military
applications.
By using SLCCs, the ‘’Stack’’ family of modules offer a higher
board density of memory than available with conventional
through-hole, surface mount or hybrid techniques.
FEATURES:
Organization:
128K x 16 or 256K x 8
Fast Access Times (max.):
120, 150, 170, 200, 250ns
Fully Static Operation - No clock or refresh required
TTL Compatible Inputs and Outputs
Common Data Inputs and Outputs
10,000 Erase/Program Cycles (min.)
Packages Available:
48 - Pin SLCC Stack
48 - Pin Straight Leaded Stack
48 - Pin ‘’J’’ Leaded Stack
48 - Pin Gullwing Leaded Stack
50 - Pin PGA Dense-Stack
DPZ128X16IHY
DPZ128X16IJY
DPZ128X16IY
DPZ128X16IIY
DPZ128X16IA3
526Kx8/128Kx16, 150 - 250ns, SLCC/PGA
30A071-13
D
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
30A071-13
REV. D
1
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