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參數(shù)資料
| 型號： | DME3936-000 |
| 廠商： | SKYWORKS SOLUTIONS INC |
| 元件分類： | 射頻混頻器 |
| 英文描述： | SILICON, MEDIUM BARRIER SCHOTTKY, S BAND, MIXER DIODE |
| 封裝： | GREEN, DIE-4 |
| 文件頁數(shù)： | 3/6頁 |
| 文件大小： | 456K |
| 代理商： | DME3936-000 |
Data Sheet Silicon BeamleSS Schottky DioDeS
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
200793 Rev. B Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice. December 18, 2008
3
characteristic
Value
TSTG
-65 °C to +175 °C
TOP
-65 °C to +150 °C
PDISS CW
75 mW/junction
IMAX
50 mA V
PIV
VB rating
Absolute Maximum Ratings
Performance is guaranteed only under the conditions listed in the specifications table and is
not guaranteed under the full range(s) described by the Absolute Maximum Ratings. Exceeding
any of the absolute maximum/minimum specifications may result in permanent damage to the
device and will void the warranty.
CAUTION: Although these devices are designed to be robust, ESD
(Electrostatic Discharge) can cause permanent damage.
Static charges may easily produce potentials of several
kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD
precautions must be employed at all times.
Assembly and Handling Procedure
The process flow for assembly is:
1. Die attach using nonconductive epoxy
2. Wire bond
3. Encapsulation—nonconductive epoxy
Die Attach Methods
All leadless chips are compatible with both eutectic and conduc-
tive epoxy die attach methods. Eutectic processes use Sn/Au or
Sn/Pb solder. Nonconductive die attach is recommended.
Packing Methods
1. Vacuum release gel pack.
2. Wafer on film frame (rejects are marked with ink).
– Diced, ready for pick and place
– Unsawn whole wafer, 7 mil thick, max.
Wire Bonding
Two methods can be used to connect wire, ribbon, or wire mesh
to the chips:
l
Thermocompression
l
Ballbonding
Skyworks recommends use of pure gold wire
Typical Bonding Configuration
Ring Quad
Crossover Quad
Bond Pad
13
24
13
24
Bond Pad
551-002
0.015 (0.381 mm)
± 0.001 (0.025 mm)
0.015 (0.381 mm)
± 0.001 (0.025 mm)
3
2
4
1
0.0035 (0.089 mm)
± 0.0035 (0.089 mm)
4 Plcs.
Schematic
0.006 (0.18 mm)
± 0.001 (0.025 mm)
13
2
4
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| DME3939-000 | SILICON, MEDIUM BARRIER SCHOTTKY, S-X BAND, MIXER DIODE |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| DME3939-000 | 制造商:Skyworks Solutions Inc 功能描述:RF SCHOTTKY DIODE |
| DME3939-257 | 制造商:Skyworks Solutions Inc 功能描述:RF SCHOTTKY DIODE |
| DME3943-000 | 制造商:Skyworks Solutions Inc 功能描述:RF SCHOTTKY DIODE |
| DME3946 | 制造商:ALPHA 制造商全稱:ALPHA 功能描述:Chip On Board Mixer Quads |
| DME3946-000 | 制造商:Skyworks Solutions Inc 功能描述:RF SCHOTTKY DIODE |
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