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參數(shù)資料
| 型號： | DIP40 |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | Thermal Data |
| 中文描述： | 熱數(shù)據(jù) |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 29K |
| 代理商： | DIP40 |
Thermal Data
DIP 40
item #
material
thickness
thermal
conductivity
leadframe
copper
0.25 mm
2.61 W/cm°C
die attach
epoxy glue
( silver filler )
10-40 μm
0.01 W/cm°C
molding
compound
epoxy resin
3.8 mm
0.0063W/cm°C
PACKAGE MATERIAL LIST
September 1999 1/2
Charts enclosed :
1)
Rth(j-a) vs power dissipation
2)
Zth(j-a) vs time
40 leads
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