4
FN3283.8
June 13, 2006
Absolute Maximum Ratings
Thermal Information
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44.0V
GND to V-. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25V
Digital Inputs, VS, VD (Note 3). . . . . .(V-) -2V to (V+) + 2V or 20mA,
Whichever Occurs First
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 30mA
Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . 100
mA
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
Thermal Resistance (Typical, Note 4)
θJA (°C/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
110
TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . .
150
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . -65°C to 125°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC and TSSOP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. Signals on SX, DX, EN or AX exceeding V+ or V- are clamped by internal diodes. Limit diode current to maximum current ratings.
4.
θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
Test Conditions: V+ = +15V, V- = -15V, VAL = 0.8V, VAH = 2.4V, Unless Otherwise Specified
PARAMETER
TEST CONDITIONS
TEMP (°C)
(NOTE 5)
MIN
(NOTE 6)
TYP
(NOTE 5)
MAX
UNITS
DYNAMIC CHARACTERISTICS
Transition Time, tTRANS
(See Figure 1)
Full
-
160
250
ns
Break-Before-Make Interval, tOPEN
(See Figure 3)
25
10
-
ns
Enable Turn-ON Time, tON(EN)
(See Figure 2)
25
-
115
150
ns
Full
-
225
ns
Enable Turn-OFF Time, tOFF(EN)
(See Figure 2)
Full
-
105
150
ns
Charge Injection, Q
CL = 10nF, VS = 0V
25
-
20
-
pC
OFF Isolation
VEN = 0V, RL = 1k,
f = 100kHz (Note 9)
25
-
-75
-
dB
Logic Input Capacitance, CIN
f = 1MHz
25
-
8
-
pF
Source OFF Capacitance, CS(OFF)
VEN = 0V, VS = 0V,
f = 1MHz
25
-
3
-
pF
Drain OFF Capacitance, CD(OFF)
VEN = 0V, VD = 0V,
f = 1MHz
DG408
25
-
26
-
pF
DG409
25
-
14
-
pF
Drain ON Capacitance, CD(ON)
VEN = 3V, VD = 0V,
f = 1MHz, VA = 0V or 3V
DG408
25
-
37
-
pF
DG409
25
-
25
-
pF
DIGITAL INPUT CHARACTERISTICS
Logic Input Current,
Input Voltage High, IAH
VA = 2.4V, 15V
Full
-10
-
10
A
Logic Input Current,
Input Voltage Low, IAL
VEN = 0V, 2.4V,
VA = 0V
Full
-10
-
10
A
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG
Full
-15
-
15
V
Drain-Source ON Resistance,
rDS(ON)
VD = ±10V, IS = -10mA
(Note 7)
25
-
40
100
Full
-
125
rDS(ON) Matching Between Channels,
r
DS(ON)
VD = 10V, -10V (Note 8)
25
-
15
Source OFF Leakage Current, IS(OFF)
VEN = 0V, VS = ±10V,
VD = +10V
25
-0.5
-
0.5
nA
Full
-5
-
5
nA
DG408, DG409