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參數(shù)資料
| 型號(hào)： | DG3002DB-T1-E1 |
| 廠商： | Vishay Siliconix |
| 文件頁(yè)數(shù)： | 3/13頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC SWITCH SPST 6-MICRO FOOT |
| 標(biāo)準(zhǔn)包裝： | 3,000 |
| 功能： | 開關(guān) |
| 電路： | 1 x SPST - NC/NO |
| 導(dǎo)通狀態(tài)電阻： | 700 毫歐 |
| 電壓電源： | 單電源 |
| 電壓 - 電源，單路/雙路(±)： | 1.8 V ~ 5.5 V |
| 電流 - 電源： | 100nA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 6-WFBGA |
| 供應(yīng)商設(shè)備封裝： | 6-Micro Foot? |
| 包裝： | 帶盒（TB） |
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AN824
Vishay Siliconix
www.vishay.com
2
Document Number: 71990
06-Jan-03
TABLE 1
Main Parameters of Solder Bumps in MICRO FOOT Designs
MICRO FOOT CSP
Bump Material
Bump Pitch*
Bump Diameter*
Bump Height*
MICRO FOOT CSP MOSFET
Eutectic Solder:
0.8
0.37-0.41
0.26-0.29
MICRO FOOT CSP Analog Switch
Eutectic Solder:
63Sm/37Pb
0.5
0.18-0.25
0.14-0.19
MICRO FOOT UCSP Analog Switch
63Sm/37Pb
0.5
0.32-0.34
0.21-0.24
* All measurements in millimeters
MICRO FOOT’S DESIGN AND RELIABILITY
As a mechanical, electrical, and thermal connection between
the device and PCB, the solder bumps of MICRO FOOT
products are mounted on the top active surface of the die.
Table 1 shows the main parameters for solder bumps used in
MICRO FOOT products. A silicon nitride passivation layer is
applied to the active area as the last masking process in
fabrication,ensuring that the device passes the pressure pot
test. A green laser is used to mark the backside of the die
without damaging it. Reliability results for MICRO FOOT
products mounted on a FR-4 board without underfill are shown
in Table 2.
TABLE 2
MICRO FOOT Reliability Results
Test Condition C: 65_ to 150_C
>500 Cycles
Test condition B: 40_ to 125_C
>1000 Cycles
121_C @ 15PSI 100% Humidity Test
96 Hours
The main failure mechanism associated with wafer-level
chip-scale packaging is fatigue of the solder joint. The results
shown in Table 2 demonstrate that a high level of reliability can
be achieved with proper board design and assembly
techniques.
BOARD LAYOUT GUIDELINES
Board materials. Vishay Siliconix MICRO FOOT products are
designed to be reliable on most board types, including organic
boards such as FR-4 or polyamide boards. The package
qualification information is based on the test on 0.5-oz. FR-4
and polyamide boards with NSMD pad design.
Land patterns. Two types of land patterns are used for
surface-mount packages. Solder mask defined (SMD) pads
have a solder mask opening smaller than the metal pad
(Figure 3), whereas on-solder mask defined (NSMD) pads
have a metal pad smaller than the solder-mask opening
(Figure 4).
NSMD is recommended for copper etch processes, since it
provides a higher level of control compared to SMD etch
processes. A small-size NSMD pad definition provides more
area (both lateral and vertical) for soldering and more room for
escape routing on the PCB. By contrast, SMD pad definition
introduces a stress concentration point near the solder mask
on the PCB side that may result in solder joint cracking under
extreme fatigue conditions.
Copper pads should be finished with an organic solderability
preservative
(OSP)
coating.
For
electroplated
nickel-immersion gold finish pads, the gold thickness must be
less than 0.5 mm to avoid solder joint embrittlement.
FIGURE 3. SMD
FIGURE 4. NSMD
Copper
Solder Mask
Copper
Solder Mask
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DG3002-T1 | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:MICRO FOOT 3x2: 0.5-mm PITCH, 0.165-mm BUMP HEIGHT |
| DG3003 | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Low-Voltage Sub-ohm SPST/SPDT MICRO FOOT Analog Switch |
| DG3003DB | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Low-Voltage Sub-Ohm SPST/SPDT MICRO FOOT Analog Switch |
| DG3003DB-T1 | 制造商:VISHAY 制造商全稱:Vishay Siliconix 功能描述:Low-Voltage Sub-ohm SPST/SPDT MICRO FOOT Analog Switch |
| DG3003DB-T1-E1 | 功能描述:模擬開關(guān) IC Low Volt Single SPDT RoHS:否 制造商:Texas Instruments 開關(guān)數(shù)量:2 開關(guān)配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時(shí)間（最大值）: 關(guān)閉時(shí)間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
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