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參數(shù)資料
| 型號(hào)： | DFNS16-BLZ1.000MHZXE50 |
| 廠(chǎng)商： | CTS CORP |
| 元件分類(lèi)： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 1 MHz, HCMOS/TTL OUTPUT |
| 封裝： | ROHS COMPLIANT, MINIATURE, CERAMIC, SMD, 4 PIN |
| 文件頁(yè)數(shù)： | 4/4頁(yè) |
| 文件大?。?/td> | 113K |
| 代理商： | DFNS16-BLZ1.000MHZXE50 |
FREQUENCY CONTROL PRODUCTS
TYPE
HAND. GUIDELINES
REVISION
05
CHECKED
NE
DATE
29.10.2007
PAGE
RoHS SMD PRODUCTS SOLDERING GUIDELINES
1. WASHING CONDITIONS
Our non hermetic SMD products are strictly non-washable as liquid cleaning solutions could penetrate the base to cap seal.
No-washing type flux with no washing is highly recommended. Please consult factory for any other process.
2. REFLOW SOLDERING CONDITIONS
Reflow profile:
25
Ts min
Ts max
Tp
TL
ts
tL
tp
t 25°C to Peak
T
em
p
er
at
ur
e
Time
PROFILE DATA
Minimum preheat temperature
Ts min
150°C
Maximum preheat temperature
Ts max
200°C
Preheat time
Ts min to TS max
90 - 180 seconds
Average ramp-up rate
Ts max to Tp
3°C/second max.
Reflow temperature
TL
217°C
Reflow time
tL
60 - 150 seconds
Peak temperature
TP
According to Jedec J-STD-020C
Peak time
tp
20 - 40 seconds
Average down ramp rate
6°C/seconds max.
Time 25°C to peak temperature
8 min max.
This profile is applicable for the following packages: S1, S2, S3, S4, S5, S7, S8, S11, S13, and S15
Additional recommendations:
do not vibrate during reflow soldering
do not reflow solder on back side
Only one reflow is allowed
solder adhesion may vary depending on the motherboard’s thermal capacity and other factors
Hand soldering (not recommended):
Maximum temperature: 300°C/5 sec, fine tipped soldering iron
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