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參數(shù)資料
| 型號： | DFLS120L-7 |
| 廠商： | DIODES INC |
| 元件分類： | 參考電壓二極管 |
| 英文描述： | 1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER |
| 中文描述： | 1 A, 20 V, SILICON, SIGNAL DIODE |
| 封裝： | GREEN, PLASTIC, POWERDI 123, 2 PIN |
| 文件頁數(shù)： | 1/3頁 |
| 文件大小： | 171K |
| 代理商： | DFLS120L-7 |
e
3
DS30444 Rev. 3 - 2
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
Diodes Incorporated
1 of 3
DFLS120L
DFLS120L
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI
123
Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
@ T
A
= 25
°
C unless otherwise specified
Mechanical Data
Characteristic
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
F(AV)
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
20
V
14
1.0
V
A
I
FSM
50
A
T
C
U
D
O
R
P
W
E
N
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
High Current Capability and Low Forward Voltage Drop
Lead Free Finish, RoHS Compliant (Note 4)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101
Standards for High
Reliability
Case: PowerDI
123
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202,
Method 208
Marking & Type Code Information: See Last Page
Weight: 0.01 grams (approx.)
Ordering Information: See Last Page
Thermal Characteristics
Characteristic
Symbol
P
D
P
D
R
θ
JA
R
θ
JA
R
θ
JS
T
j
T
STG
Value
1.67
556
60
180
10
-55 to +125
-55 to +150
Unit
W
mW
°C/W
°
C/W
°C/W
°
C
°C
Power Dissipation (Note 1) @ T
A
= 25
°
C
Power Dissipation (Note 2) @ T
A
= 25
°
C
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Soldering (Note 3)
Operating Temperature Range
Storage Temperature Range
Notes: 1. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode.
2. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads.
3. Theoretical R
θ
JS
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
Features
TOP VIEW
BOTTOM VIEW
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