參數(shù)資料
型號: DF20G-20DP-1H
廠商: Hirose Electric USA, INC.
英文描述: 1 mm Pitch Double Rows Low Profile Board-to-Cable Connectors
中文描述: 1毫米間距雙排超薄板對線連接器
文件頁數(shù): 7/7頁
文件大小: 235K
代理商: DF20G-20DP-1H
7
B
Usage recommendation
Temperature
IR Reflow
Preheating: 150°C for 60 sec. to 120 sec.
Soldering: 235°C±5°C for 10 sec. max.
... Maximum 240°C 220°C min.
10s to 30s ... 220°C
Preheating
Soldering
Maximum 240°C
220°C
1. Recommended Soldering
Temperature Profile for IR Reflow.
2.
Recommended Manual Soldering Conditions
3.
Recommended Solder Screen Thickness
4. Board Warping
5. Cleaning Conditions
6. Wiring Termination Conditions
7.
Mating / un-mating precautions
Soldering temperature: 290°C ±10°C, Soldering time: within 3 sec.
0.15mm
Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points.
Refer to "Nylon Connector Use Handbook."
Refer to "Nylon Connector Use Handbook."
Crimp contacts should be handled with care as not to cause any deformation or damage
affecting the performance or termination.
Excessive twisting and pulling on wires during mating/un-mating should be avoided as it
may cause damage to connectors.
Note 1:
Up to 2 cycles of reflow soldering are possible under the same conditions, provided
that there is a return to normal temperature between the first and second cycle.
Note 2: The temperature indicates the board surface temperature at the points of contacts
with the connector terminals.
相關PDF資料
PDF描述
DF20G-20DP-1V 1 mm Pitch Double Rows Low Profile Board-to-Cable Connectors
DF20G-20DS-1C 1 mm Pitch Double Rows Low Profile Board-to-Cable Connectors
DF20G-20DS-1V 1 mm Pitch Double Rows Low Profile Board-to-Cable Connectors
DF20G-30DP-1C 1 mm Pitch Double Rows Low Profile Board-to-Cable Connectors
DF20G-30DP-1H 1 mm Pitch Double Rows Low Profile Board-to-Cable Connectors
相關代理商/技術參數(shù)
參數(shù)描述
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