Please refer to
參數(shù)資料
型號: DC1369A-I
廠商: Linear Technology
文件頁數(shù): 26/34頁
文件大小: 0K
描述: BOARD DEMO 80MSPS LTC2259-12
軟件下載: QuikEval II System
設(shè)計資源: DC1369A Design Files
標(biāo)準(zhǔn)包裝: 1
系列: *
相關(guān)產(chǎn)品: DC890B-ND - BOARD USB DATA COLLECTION
LTC2261-12
LTC2260-12/LTC2259-12
32
226112fc
For more information www.linear.com/LTC2261-12
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
6.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1 NOTCH
R = 0.45 OR
0.35
× 45°
CHAMFER
0.40 ±0.10
40
39
1
2
BOTTOM VIEW—EXPOSED PAD
4.50 REF
(4-SIDES)
4.42 ±0.10
4.42 ±0.05
0.75 ±0.05
R = 0.115
TYP
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UJ40) QFN REV 0406
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
4.50 ±0.05
(4 SIDES)
5.10 ±0.05
6.50 ±0.05
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE
R = 0.10
TYP
UJ Package
40-Lead Plastic QFN (6mm
× 6mm)
(Reference LTC DWG # 05-08-1728 Rev )
相關(guān)PDF資料
PDF描述
1866 LAMP T3-1/4 MINI BAYONET BASE
1680 LAMP S-8 SGL CONTACT BAY BASE
DC1369A-C BOARD DEMO 80MSPS LTC2259-14
5AB LAMP NEON WIRE TERMINAL NE-23
DC1369A-H BOARD DEMO 105MSPS LTC2260-12
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