型號(hào) | 廠商 | 描述 |
1n3206 2 3 |
MICROSEMI CORP-SCOTTSDALE | PELLET DIODES |
1n3207 2 3 |
MICROSEMI CORP-SCOTTSDALE | PELLET DIODES |
1n3069m 2 3 |
MICROSEMI CORP-SCOTTSDALE | PELLET DIODES |
1n897 2 3 |
MICROSEMI CORP-SCOTTSDALE | PELLET DIODES |
1n900 2 3 |
MICROSEMI CORP-SCOTTSDALE | PELLET DIODES |
1n964 2 3 |
Semtech Corporation | CONN HDR 2POS SGL STR |
1n964a 2 3 |
Semtech Corporation | HEADER, STRAIGHT, 3 PIN,0.230 |
1n965 2 3 |
Semtech Corporation | CONN, 3PX1R TH STRAIGHT |
1n965a 2 3 |
Semtech Corporation | HDR 4X1POS SHORT ST GOLD |
1n966 2 3 |
Semtech Corporation | HEADER, UNSHROUDED, 4 PIN, DUAL |
1n966a 2 3 |
Semtech Corporation | HEADR, MALE, 6 POS, SNGL, STRT, .235X.110TAIL |
1n967 2 3 |
Semtech Corporation | HEADER, 2X3 0.1"SP |
1n967a 2 3 |
Semtech Corporation | CONN HDR 8POS RT ANG POST |
1n968 2 3 |
Semtech Corporation | HEADER, UNSHROUDED, 8 PIN, DUAL |
1n968a 2 3 |
Semtech Corporation | CONN-HDR, POST, 10P 2ROW, .1SP, .230/.095,GD |
1n969 2 3 |
Semtech Corporation | CON/ UNSHROUDEDHEADER 2X5PINA |
1n969a 2 3 |
Semtech Corporation | SPLICING TAPE |
1n971 2 3 |
Semtech Corporation | 6X2 M STR AU .1"LS 0W .318"H |
1n971a 2 3 |
Semtech Corporation | 14PX2R TH STRAIGHT |
1n972 2 3 |
Semtech Corporation | HEADER,2X7,14 PIN |
1n972a 2 3 |
Semtech Corporation | CON, HDR, 2X8,0.1", M,ST, PTH |
1n973 2 3 |
Semtech Corporation | CONN, HDR, 0.1, 2X8, M |
1n973a 2 3 |
Semtech Corporation | RUBBER SPLICING TAPE 30 MIL COLOR: BLACK |
1n974 2 3 |
Semtech Corporation | Masking Tape; Tape Backing Material:Crepe Paper; Width:24mm; Roll Length:55m; Adhesive Material:Rubber; Color:Natural; Leaded Process Compatible:No; Pack Quantity:1 RoHS Compliant: Yes |
1n974a 2 3 |
Semtech Corporation | DIP Socket; No. of Contacts:32; Pitch Spacing:0.1"; Row Spacing:0.4"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n975 2 3 |
Semtech Corporation | DIP Socket; No. of Contacts:32; Pitch Spacing:0.1"; Row Spacing:0.6"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n975a 2 3 |
Semtech Corporation | DIP Socket; No. of Contacts:32; Pitch Spacing:0.1"; Row Spacing:0.6"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n976 2 3 |
Semtech Corporation | DIP Socket; No. of Contacts:32; Pitch Spacing:0.1"; Row Spacing:0.6"; Terminal Type:Solder Tail; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n976a 2 3 |
Semtech Corporation | DIP Socket; No. of Contacts:32; Pitch Spacing:0.1"; Row Spacing:0.6"; Terminal Type:Wire Wrap; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n977 2 3 |
Semtech Corporation | DIP Socket; No. of Contacts:32; Pitch Spacing:0.1"; Row Spacing:0.45"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n977a 2 3 |
Semtech Corporation | DIP Socket; No. of Contacts:32; Pitch Spacing:0.07"; Row Spacing:0.4"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n978 2 3 |
Semtech Corporation | SIP Socket; No. of Contacts:32; Pitch Spacing:0.1"; Terminal Type:PC Board; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
1n978a 2 3 |
Semtech Corporation | HEADER, STRAIGHT, 26PINS, 2 ROW, 0.230 |
1n979a 2 3 |
MICROSEMI CORP-LAWRENCE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n981a 2 3 |
MICROSEMI CORP-SCOTTSDALE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n963a 2 3 |
MICROSEMI CORP-SCOTTSDALE | MVSTBW 2,5/21-ST |
1n964c 2 3 |
MICROSEMI CORP-LAWRENCE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n964d 2 3 |
MICROSEMI CORP-LAWRENCE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n965a 2 3 |
MICROSEMI CORP-LAWRENCE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n965c 2 3 |
MICROSEMI CORP-SCOTTSDALE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n967c 2 3 |
MICROSEMI CORP | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n967d 2 3 |
MICROSEMI CORP-SCOTTSDALE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n968a 2 3 |
MICROSEMI CORP-LAWRENCE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n968c 2 3 |
MICROSEMI CORP | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n968d 2 3 |
MICROSEMI CORP | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n969a 2 3 |
MICROSEMI CORP-LAWRENCE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n969c 2 3 |
MICROSEMI CORP-SCOTTSDALE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n972a 2 3 |
MICROSEMI CORP-LAWRENCE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n958a 2 3 |
MICROSEMI CORP-SCOTTSDALE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |
1n962c 2 3 |
MICROSEMI CORP-SCOTTSDALE | METALLURGICALLY BONDED DOUBLE PLUG CONSTRUCTION |