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參數(shù)資料
| 型號： | DAC8531E/250G4 |
| 廠商： | Texas Instruments |
| 文件頁數(shù)： | 10/27頁 |
| 文件大小： | 0K |
| 描述： | IC D/A CONV LP 16-BIT 8-MSOP |
| 產(chǎn)品培訓(xùn)模塊： | Data Converter Basics |
| 標(biāo)準(zhǔn)包裝： | 250 |
| 設(shè)置時間： | 8µs |
| 位數(shù)： | 16 |
| 數(shù)據(jù)接口： | 串行 |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 單電源 |
| 功率耗散（最大）： | 720µW |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-TSSOP，8-MSOP（0.118"，3.00mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-MSOP |
| 包裝： | 帶卷 (TR) |
| 輸出數(shù)目和類型： | 1 電壓，單極；1 電壓，雙極 |
| 采樣率（每秒）： | 93k |
| 配用： | 296-13548-ND - EVAL MOD FOR DAC8531 |
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
DAC8531E/250
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-2-260C-1 YEAR
-40 to 105
D31
DAC8531E/250G4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-2-260C-1 YEAR
-40 to 105
D31
DAC8531E/2K5
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-2-260C-1 YEAR
-40 to 105
D31
DAC8531E/2K5G4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG Level-2-260C-1 YEAR
-40 to 105
D31
DAC8531IDRBR
ACTIVE
SON
DRB
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 105
D31
DAC8531IDRBRG4
ACTIVE
SON
DRB
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 105
D31
DAC8531IDRBT
ACTIVE
SON
DRB
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 105
D31
DAC8531IDRBTG4
ACTIVE
SON
DRB
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 105
D31
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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