
DAC8501
SBAS212A
2
www.ti.com
V
to GND...........................................................................
–
0.3V to +6V
Digital Input Voltage to GND .................................
–
0.3V to +V
DD
+ 0.3V
V
OUT
to GND ..........................................................
–
0.3V to +V
DD
+ 0.3V
V
REF
to GND ...........................................................
–
0.3V to +V
DD
+ 0.3V
V
to GND.............................................................
–
0.3V to +V
+ 0.3V
Operating Temperature Range ......................................
–
40
°
C to +105
°
C
Storage Temperature Range .........................................
–
65
°
C to +150
°
C
Junction Temperature Range (T
max) ........................................ +150
°
C
Power Dissipation ........................................................ (T
max
—
T
A
)/
θ
JA
θ
JA
Thermal Impedance......................................................... 206
°
C/W
θ
Thermal Impedance........................................................... 44
°
C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215
°
C
Infrared (15s) ........................................................................ +220
°
C
NOTE: (1) Stresses above those listed under Absolute Maximum Ratingsmay
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS
(1)
PACKAGE/ORDERING INFORMATION
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
SPECIFICATION
TEMPERATURE
RANGE
PACKAGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
PRODUCT
PACKAGE-LEAD DESIGNATOR
(1)
DAC8501E
±
64
"
±
1
"
MSOP-8
"
DGK
"
–
40
°
C to +105
°
C
"
D01
"
DAC8501E/250
DAC8501E/2K5
Tape and Reel, 250
Tape and Reel, 2500
"
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PIN
NAME
DESCRIPTION
1
V
DD
V
REF
V
FB
V
OUT
Power-Supply Input, +2.7V to +5.5V
2
Reference Voltage Input
3
Feedback connection for the output amplifier.
4
Analog output voltage from DAC. The output ampli-
fier has rail-to-rail operation.
5
SYNC
Level-triggered control input (active LOW). This is
the frame synchronization signal for the input data.
When SYNC goes LOW, it enables the input shift
register and data is transferred in on the falling
edges of the following clocks. The DAC is updated
following the 24th clock cycle unless SYNC is taken
HIGH before this edge, in which case the rising
edge of SYNC acts as an interrupt and the write
sequence is ignored by the DAC8501.
6
SCLK
Serial Clock Input. Data can be transferred at rates
up to 30MHz.
7
D
IN
Serial Data Input. Data is clocked into the 24-bit
input shift register on the falling edge of the serial
clock input.
8
GND
Ground reference point for all circuitry on the part.
PIN DESCRIPTION
PIN CONFIGURATIONS
Top View
MSOP
V
DD
V
REF
V
FB
V
OUT
GND
D
IN
SCLK
SYNC
1
2
3
4
8
7
6
5
DAC8501
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.