DAC8420
Rev. B | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
0.3 V, +18.0 V
VSS to GND
+0.3 V, 18.0 V
VSS to VDD
0.3 V, +36.0 V
VSS to VVREFLO
0.3 V, VSS 2.0 V
VVREFHI to VVREFLO
+2.0 V, VDD VSS
VVREFHI to VDD
+2.0 V, +33.0 V
IVREFHI, IVREFLO
10 mA
Digital Input Voltage to GND
0.3 V, VDD + 0.3 V
Output Short-Circuit Duration
Indefinite
Operating Temperature Range
EP, FP, ES, FS, EQ, FQ
–40°C to +85°C
Dice Junction Temperature
150°C
Storage Temperature Range
–65°C to +150°C
Power Dissipation
1000 mW
Lead Temperature
JEDEC Industry Standard
Soldering
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 4.
Package Type
θJA
θJC
Unit
16-Lead PDIP (N)
27
°C/W
16-Lead CERDIP (Q)
9
°C/W
16-Lead SOIC (RW)
22
°C/W
1 θJA is specified for worst case mounting conditions, that is, θJA is specified for
device in socket.
2 θJA is specified for device on board.
ESD CAUTION