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| 型號(hào)： | DAC8248FS |
| 廠商： | Analog Devices Inc |
| 文件頁(yè)數(shù)： | 11/16頁(yè) |
| 文件大小： | 0K |
| 描述： | IC DAC 12BIT DUAL W/BUFF 24-SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Data Converter Fundamentals DAC Architectures |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 設(shè)置時(shí)間： | 1µs |
| 位數(shù)： | 12 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 2 |
| 電壓電源： | 單電源 |
| 功率耗散（最大）： | 50µW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 24-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 24-SOIC W |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 2 電流，單極；2 電流，雙極 |
| 采樣率（每秒）： | 1M |
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DAC8248
–4–
REV. B
ORDERING GUIDE
1
Relative
Accuracy
Gain Error
Temperature
Package
Model
(+5 V or +15 V)
Range
Description
DAC8248AW
2
±1/2 LSB
±1 LSB
–55
°C to +125°C
24-Pin Cerdip
DAC8248EW
±1/2 LSB
±1 LSB
–40
°C to +85°C
24-Pin Cerdip
DAC8248GP
±1/2 LSB
±2 LSB
0
°C to +70°C
24-Pin Plastic DIP
DAC8248FW
±1 LSB
±4 LSB
–40
°C to +85°C
24-Pin Cerdip
DAC8248HP
±1 LSB
±4 LSB
0
°C to +70°C
24-Pin Plastic DIP
DAC8248FP
±1 LSB
±4 LSB
–40
°C to +85°C
24-Pin Plastic DIP
DAC8248HS
3
±1 LSB
±4 LSB
0
°C to +70°C
24-Pin SOL
NOTES
1Burn-in is available on commercial and industrial temperature range parts in cerdip, plastic DIP, and TO-can packages.
2For devices processed in total compliance to MIL-STD-883, add/883 after part number. Consult factory for 883 data sheet.
3For availability and burn-in information on SO and PLCC packages, contact your local sales office.
(continued from page 1)
operates on a single supply from +5 V to +15 V, and it dissi-
pates less than 0.5 mW at +5 V (using zero or VDD logic levels).
The device is packaged in a space-saving 0.3", 24-pin DIP.
The DAC8248 is manufactured with PMI’s highly stable thin-
film resistors on an advanced oxide-isolated, silicon-gate,
CMOS technology. PMI’s improved latch-up resistant design
eliminates the need for external protective Schottky diodes.
ABSOLUTE MAXIMUM RATINGS
(TA = +25°C, unless otherwise noted.)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD +0.3 V
IOUT A, IOUT B to AGND . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
VREF A, VREF B to AGND . . . . . . . . . . . . . . . . . . . . . . . .
±25 V
VRFB A, VRFB B to AGND . . . . . . . . . . . . . . . . . . . . . . . .
±25 V
Operating Temperature Range
AW Version . . . . . . . . . . . . . . . . . . . . . . . –55
°C to +125°C
EW, FW, FP Versions . . . . . . . . . . . . . . . . –40
°C to +85°C
GP, HP, HS Versions . . . . . . . . . . . . . . . . . . . 0
°C to +70°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°C
Package Type
JA
1
JC
Units
24-Pin Hermetic DIP (W)
69
10
°C/W
24-Pin Plastic DIP (P)
62
32
°C/W
24-Pin SOL (S)
72
24
°C/W
NOTE
1
JA specified for worst case mounting conditions, i.e.,
JA is specified for device in
socket for cerdip and P-DIP packages; JA is specified for device soldered to printed
circuit board for SOL package.
CAUTION
1. Do not apply voltages higher than VDD or less than GND
potential on any terminal except VREF and RFB.
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Do not insert this device into powered sockets; remove
power before insertion or removal.
4. Use proper antistatic handling procedures.
5. Devices can suffer permanent damage and/or reliability deg-
radation if stressed above the limits listed under Absolute
Maximum Ratings for extended periods. This is a stress rat-
ing only and functional operation at or above this specifica-
tion is not implied.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8248 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| DAC8248FS-REEL | 功能描述:IC DAC 12BIT DUAL W/BUFF 24-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals DAC Architectures 標(biāo)準(zhǔn)包裝:750 系列:- 設(shè)置時(shí)間:7µs 位數(shù):16 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:雙 ± 功率耗散（最大）:100mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-LCC（J 形引線） 供應(yīng)商設(shè)備封裝:28-PLCC（11.51x11.51） 包裝:帶卷 (TR) 輸出數(shù)目和類型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:143k |
| DAC8248FSZ | 功能描述:IC DAC 12BIT DUAL W/BUFF 24SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 設(shè)置時(shí)間:4.5µs 位數(shù):12 數(shù)據(jù)接口:串行，SPI? 轉(zhuǎn)換器數(shù)目:1 電壓電源:單電源 功率耗散（最大）:- 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOICN 包裝:剪切帶 (CT) 輸出數(shù)目和類型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:* 其它名稱:MCP4921T-E/SNCTMCP4921T-E/SNRCTMCP4921T-E/SNRCT-ND |
| DAC8248FSZ-REEL | 功能描述:IC DAC 12BIT DUAL W/BUFF 24SOIC RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 產(chǎn)品培訓(xùn)模塊:Data Converter Fundamentals DAC Architectures 標(biāo)準(zhǔn)包裝:750 系列:- 設(shè)置時(shí)間:7µs 位數(shù):16 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 電壓電源:雙 ± 功率耗散（最大）:100mW 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-LCC（J 形引線） 供應(yīng)商設(shè)備封裝:28-PLCC（11.51x11.51） 包裝:帶卷 (TR) 輸出數(shù)目和類型:1 電壓，單極；1 電壓，雙極 采樣率（每秒）:143k |
| DAC8248FW | 制造商:Analog Devices 功能描述: |
| DAC8248GBC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:12-Bit Digital-to-Analog Converter |
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