(TA = +25 °C, unless otherwise noted" />
參數(shù)資料
型號(hào): DAC8222GPZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 9/15頁(yè)
文件大?。?/td> 0K
描述: IC DAC 12BIT DUAL W/BUFF 24DIP
產(chǎn)品培訓(xùn)模塊: Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝: 15
設(shè)置時(shí)間: 1µs
位數(shù): 12
轉(zhuǎn)換器數(shù)目: 2
電壓電源: 單電源
工作溫度: 0°C ~ 70°C
安裝類型: 通孔
封裝/外殼: 24-DIP(0.300",7.62mm)
供應(yīng)商設(shè)備封裝: 24-PDIP
包裝: 管件
輸出數(shù)目和類型: 2 電流,單極;2 電流,雙極
采樣率(每秒): 1M
DAC8222
–3–
REV. C
ABSOLUTE MAXIMUM RATINGS
(TA = +25
°C, unless otherwise noted.)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD +0.3 V
IOUTA, IOUTB to AGND . . . . . . . . . . . . . . –0.3 V, VDD +0.3 V
VREFA, VREFB to AGND . . . . . . . . . . . . . . . . . . . . . . . . .
±25 V
VRFBA, VRFBB to AGND . . . . . . . . . . . . . . . . . . . . . . . . .
±25 V
Operating Temperature Range
AW Version . . . . . . . . . . . . . . . . . . . . . . . –55
°C to +125°C
EW, FW, FP Versions . . . . . . . . . . . . . . . . –40
°C to +85°C
GP, HP, HS Versions . . . . . . . . . . . . . . . . . . . 0
°C to +70°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300
°C
Package Type
JA
1
JC
Units
24-Lead Hermetic DIP (W)
69
10
°C/W
24-Lead Plastic DIP (P)
62
32
°C/W
24-Lead SOL (S)
72
24
°C/W
NOTE
1
θ
JA is specified for worst-case mounting conditions, i.e., qJA is specified for
device in socket for Cerdip, and P-DIP packages; JA is specified for device
soldered to printed circuit board for SO package.
CAUTION
1. Do not apply voltages higher than VDD or less than GND
potential on any terminal except VREF and RFB.
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high-energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Do not insert this device into powered sockets; remove
power before insertion or removal.
4. Use proper antistatic handling procedures.
5. Devices can suffer permanent damage and/or reliability deg-
radation if stressed above the limits listed under Absolute
Maximum Ratings for extended periods.
PIN CONNECTIONS
24-Lead 0.3" Cerdip
24-Lead Plastic DIP
24-Lead SOL
28-Terminal LCC
NC = NO CONNECT
ORDERING GUIDE
INL
GFSE
Temperature
Package
Model
(LSB) (LSB)
Range
Description
Option
DAC8222EW
±1/2
± 1
–40
°C to +85°C
Cerdip-24
Q-24
DAC8222GP
±1/2
± 20°C to +70°C
P-DIP-24
N-24
DAC8222BTC/883*
±1
± 4
–55
°C to +125°C LCC-28
E-28A
DAC8222FW
±1
± 4
–40
°C to +85°C
Cerdip-24
Q-24
DAC8222FP
±1
± 4
–40
°C to +85°C
P-DIP-24
N-24
DAC8222FS
±1
± 4
–40
°C to +85°C
SOL-24
R-24
*Consult factory for DAC8222/883 MIL-STD data sheet.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8222 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
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