
DAC8222
–3–
REV. C
ABSOLUTE MAXIMUM RATINGS
(T
A
= +25
°
C, unless otherwise noted.)
V
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V, +17 V
AGND to DGND . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
+0.3 V
Digital Input Voltage to DGND . . . . . . . –0.3 V, V
DD
+0.3 V
I
OUTA
, I
OUTB
to AGND . . . . . . . . . . . . . . –0.3 V, V
DD
+0.3 V
V
REFA
, V
REFB
to AGND . . . . . . . . . . . . . . . . . . . . . . . . .
±
25 V
V
RFBA
, V
RFBB
to AGND . . . . . . . . . . . . . . . . . . . . . . . . .
±
25 V
Operating Temperature Range
AW Version . . . . . . . . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
EW, FW, FP Versions . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
GP, HP, HS Versions . . . . . . . . . . . . . . . . . . . 0
°
C to +70
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . .+150
°
C
Storage Temperature . . . . . . . . . . . . . . . . . . –65
°
C to +150
°
C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . .+300
°
C
Package Type
JA1
JC
Units
24-Lead Hermetic DIP (W)
24-Lead Plastic DIP (P)
24-Lead SOL (S)
69
62
72
10
32
24
°
C/W
°
C/W
°
C/W
NOTE
1
θ
JA
is specified for worst-case mounting conditions, i.e., q
JA
is specified for
device in socket for Cerdip, and P-DIP packages;
soldered to printed circuit board for SO package.
JA
is specified for device
CAUTION
1. Do not apply voltages higher than V
DD
or less than GND
potential on any terminal except V
REF
and R
FB
.
2. The digital control inputs are Zener-protected; however,
permanent damage may occur on unprotected units from
high-energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
3. Do not insert this device into powered sockets; remove
power before insertion or removal.
4. Use proper antistatic handling procedures.
5. Devices can suffer permanent damage and/or reliability deg-
radation if stressed above the limits listed under Absolute
Maximum Ratings for extended periods.
PIN CONNECTIONS
24-Lead 0.3" Cerdip
24-Lead Plastic DIP
24-Lead SOL
28-Terminal LCC
NC = NO CONNECT
ORDERING GUIDE
INL
(LSB) (LSB)
GFSE
Temperature
Range
Package
Description
Package
Option
Model
DAC8222EW
DAC8222GP
DAC8222BTC/883*
DAC8222FW
DAC8222FP
DAC8222FS
±
1/2
±
1/2
±
1
±
1
±
1
±
1
±
1
±
2
±
4
±
4
±
4
±
4
–40
°
C to +85
°
C
0
°
C to +70
°
C
–55
°
C to +125
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Cerdip-24
P-DIP-24
LCC-28
Cerdip-24
P-DIP-24
SOL-24
Q-24
N-24
E-28A
Q-24
N-24
R-24
*Consult factory for DAC8222/883 MIL-STD data sheet.
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8222 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.