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參數(shù)資料
| 型號： | DAC-08 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 8-bit high-speed multiplying D/A converter |
| 中文描述： | 8位高速乘法D / A轉(zhuǎn)換器 |
| 文件頁數(shù)： | 3/16頁 |
| 文件大?。?/td> | 162K |
| 代理商： | DAC-08 |
Philips Semiconductors
Product data
DAC-08 Series
8-bit high-speed multiplying D/A converter
2001 Aug 03
3
ORDERING INFORMATION
DESCRIPTION
TEMPERATURE RANGE
0 to +70
°
C
0 to +70
°
C
0 to +70
°
C
0 to +70
°
C
ORDER CODE
DWG #
16-Pin Plastic Dual In-Line Package (DIP)
DAC-08CN
SOT38-4
16-Pin Plastic Dual In-Line Package (DIP)
DAC-08EN
SOT38-4
16-Pin Plastic Small Outline (SO) Package
DAC-08ED
SOT109-1
16-Pin Plastic Dual In-Line Package (DIP)
DAC-08HN
SOT38-4
BLOCK DIAGRAM
BIAS
NETWORK
SWITCHES
MSB
B
1
LSB
B
8
V+
13
1
5
6
7
8
9
10
11
12
14
15
16
COMP.
3
4
2
V–
REFERENCE
V
REF
(+)
V
REF
(–)
V
LC
B
2
B
3
B
4
B
5
B
6
B
7
I
OUT
+
–
I
OUT
SL00002
Figure 2. Block Diagram
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
UNIT
V+ to V–
Power supply voltage
36
V
V
5
–V
12
V
LC
V
0
I
14
V
14
, V
15
P
D
Digital input voltage
V– to V– plus 36 V
Logic threshold control
V– to V+
Applied output voltage
V– to +18
V
Reference current
5.0
mA
Reference amplifier inputs
Maximum power dissipation T
amb
= 25
°
C (still-air)
1
N package
D package
V
EE
to V
CC
1450
1090
mW
mW
°
C
°
C
°
C
T
SOLD
T
amb
T
stg
NOTE:
1. Derate above 25
°
C, at the following rates:
N package at 11.6mW/
°
C
D package at 8.7mW/
°
C
Lead soldering temperature (10 sec max)
230
Operating temperature range
0 to +70
Storage temperature range
–65 to +150
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DAC-08EN | 8-bit high-speed multiplying D/A converter |
| DAC-08HN | 8-bit high-speed multiplying D/A converter |
| DAC-08CN | 8-Bit high-speed multiplying D/A converter |
| DAC-08ED | 8-bit high-speed multiplying D/A converter |
| DAC_12B_10-100NS | Analog Devices: Data Converters: DAC 12-Bit, 10 ns to 100 ns Converters Selection Table |
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