3
CONNECTOR DESIGN
In order to achieve optimum soldering
results, FCI launches dedicated
Pin-in-Paste connectors.
These connectors are fully adapted to
Pin-in-Paste processing in all aspects,
including plastic material, metal peg,
housing design, pin length,
and packaging.
PLASTIC MATERIAL:
The FCI D-Sub Pin-in-Paste connectors
are molded in high temperature plastic
able to withstand a temperature
exposure up to 260°C peak for 10 to
30 seconds in a convection infrared or
vapor-phase reflow oven.
METAL PEG:
To ensure electrical continuity and low
insertion forces, a specific metal peg
has been designed. These metal pegs
significantly increase the connection
robustness after soldering.
HOUSING DESIGN:
Standoffs are specifically designed
around the metal pegs to avoid any
paste interaction between the
back housing and the PCB.
Consequently, the paste can spread
around the metal peg, keeping the
connector in its correct and original
position.
PIN LENGTH:
The termination length beyond
the bottom of the PCB is shorter than
traditional solder-to-board products.
Thus, the risk of pushing out the solder
paste when setting the pin into the PCB
hole is very much limited. The solder
paste will not stick on the pin tip or even
fall off completely, but stays around the
pin for free flow during soldering.
FCI uses pin lengths corresponding to
the PCB thickness +0.4 mm.
For a 1.6 mm PCB thickness, the pin
length is 2.0 mm.
PACKAGING:
The FCI D-Sub connectors can be packaged in different ways depending on existing
installed processes.
Tray packaging : ideal for manual placing and low volume applications.
Tape and reel packaging with or without pick-up caps: fully compatible with
automatic pick and place processes like grippers or vacuum nozzles, for medium and
high volume applications.
D-Subminiature Pin-in-Paste