
8
VI. Rf and CRf Selection
The combination of Rf and timing capacitors, CLF
and CHF, determines the time constants for the low
frequency oscillator and the high frequency oscillator,
respectively. To simplify the tuning of the oscillator
frequencies to the desired frequency range, a standard
value is recommended for Rf = 100 k
.
The CRf capacitor is used as a stabilizing capacitor
to filter noise on the Rf line. A small 100pF capacitor
is typical and sufficient value for CRf.
VII. Fast Recovery Diode
Energy stored by the coil is eventually forced through
the external diode to power the switched H-bridge
network. A fast recovery diode, such as BAS21, is
recommended for this function for optimum
operation.
VIII. Printed Circuit Board Layout
The high frequency operation and very high voltage
IV. Wave-Shape Selection
The D306A EL Driver uses a patented wave-shaping
technique for reducing audible noise from an EL lamp.
The slope of the discharge section of the output
waveform may be adjusted by selecting a proper value
for the wave-shape discharge resistor (Rd) in series
with the E pin input. The optimal discharge level for
an application depends on the lamp size, lamp
brightness, and application conditions. To ensure that
the D306A is configured optimally, various discharge
levels should be evaluated. In many cases, lower
discharge levels may result in lower audible noise
from the EL lamp. The recommended typical value
for Rd is 10 k
.
V. Storage Capacitor (Cs) Selection
The Cs capacitor is used to store the energy transferred
from the inductor before discharging the energy to
the EL lamp. Cs values can range from 1.5nF to 4.7nF
and must have minimum 200V rating. In general, the
Cs value does not have a large affect on the output of
the device. The typical Cs capacitor recommendation
is 2.2nF with 200V rating.
output of the D306A makes printed circuit board
layout important for minimizing electrical noise.
Maintain the IC connections to the inductor as short
as possible. Connect the GND of the device directly
to the GND plane of the PCB. Keep the GND pin of
the device and the ground leads of the Cs, CLF, and
CHF less than 5mm apart. If using bypass capacitors
to minimize ripple on the supply lines, keep the
bypass caps as close as possible to the Vbat lead of
the inductor and the Vcc pin.
The higher than normal operating temperature of the
D306A also requires additional ground heat planes
on the printed circuit board layout. The D306A has a
heat slug attached to the bottom of the packge to
provide additional heat dissipation. It is recommended
that the PCB incorporate a complimentary grounded
heat plane to solder connect to the heat slug of the
package. It is also recommended that no electrical
traces, which can be adversely affected by the
temperature transfer and the high voltage output, be
laid out underneath the device. The temperture
transfer, as well as high voltage output, may adversely
affect these electrical traces. Recommended pad
layout dimensions can be found on the last page of
this datasheet.
IX. Optional Zener Diodes
The D306A EL driver circuit should be designed such
that the output voltage of the device does not exceed
the maximum rated value of 400Vpp. Operating the
D306A above this rating can cause irreversible
damage to the device. This condition is most likely
in applications, such as in automotive instrument
clusters, where the supply voltage (Vbat) is higher
than 6.0V and can generate output voltage greater
than 400Vpp. Extreme temperature change can also
cause the output voltage to exceed the maximum
rating, especially when the nominal operating voltage
of the device is close to the maximum limit at room
temperature.
A zener diode connected in parallel to the Cs capacitor
and ground of the D306A is recommended to limit
the device output to less than 400Vpp. This
component is optional and may be avoided in
applications which are known to function only within
safe operating conditions.