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參數(shù)資料
| 型號： | D2304G |
| 英文描述： | 1.3 mm D2300-Type Laser Isolated DFB Laser Module |
| 中文描述： | 1.3毫米D2300型激光隔離DFB激光器模塊 |
| 文件頁數(shù)： | 3/8頁 |
| 文件大小： | 265K |
| 代理商： | D2304G |
Data Sheet
February 2000
Lucent Technologies Inc.
3
Isolated DFB Laser Module
1.3
m D2300-Type Digital
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the performance characteristics of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect device reliability.
* Does not apply to shipping container.
Parameter
Symbol
Min
Max
Unit
Laser Reverse Voltage
VRLMAX
—2
V
dc Forward Current
IFLMAX
—
150
mA
Operating Case Temperature Range
TC
–
40
80
°C
Storage Case Temperature Range*
Tstg
–
40
85
°C
Photodiode Reverse Voltage
VRPDMAX
—
10
V
Photodiode Forward Current
IFPDMAX
—1
mA
Handling Precautions
Power Sequencing
To avoid the possibility of damage to the laser module
from power supply switching transients, follow this turn-
on sequence:
1. All ground connections
2. Most negative supply
3. Most positive supply
4. All remaining connections
Reverse the order for the proper turn-off sequence.
Electrostatic Discharge
CAUTION: This device is susceptible to damage as
a result of electrostatic discharge. Take
proper precautions during both handling
and testing. Follow guidelines such as
JEDEC Publication No. 108-A (Dec.
1988).
Lucent employs a human-body model (HBM) for ESD-
susceptibility testing and protection-design evaluation.
ESD voltage thresholds are dependent on the critical
parameters used to dene the model. A standard HBM
(resistance = 1.5 k
, capacitance = 100 pF) is widely
used and, therefore, can be used for comparison pur-
poses. The HBM ESD threshold presented here was
obtained using these circuit parameters:
Mounting Instructions
The minimum ber bend radius is 1.18 in. (30 mm).
To avoid degradation in performance, mount the mod-
ule on the board as follows:
1. Place the bottom ange of the module on a at heat
sink at least 0.5 in. x 1.180 in. (12.7 mm x 30 mm) in
size. The surface nish of the heat sink should be
better than 32
in. (0.8 m), and the surface atness
must be better than 0.001 in. (25.4
m). Using ther-
mal conductive grease is optional; however, thermal
performance can be improved by up to 5% if conduc-
tive grease is applied between the bottom ange and
the heat sink.
2. Mount four #2-56 screws with Fillister heads
(M2-3 mm) at the four screw-hole locations (see Out-
line Diagram). The Fillister head diameter must not
exceed 0.140 in. (3.55 mm). Do not apply more than
1 in.-lb. of torque to the screws.
Note: Dimensions are in inches and (millimeters).
Figure 2. Fillister Head Screw
Parameter
Value
Unit
Human-body Model
>400
V
1-532
0.118
(3.00)
0.062 (1.58)
0.140
(3.56)
0.031 (0.79)
0.129 (3.28) R
0.086
(2.18)
0.041 (1.04)
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