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參數(shù)資料
| 型號(hào)： | D2300 |
| 英文描述： | 1.3 m D2300-Type Laser Isolated DFB Laser Module |
| 中文描述： | 1.3米D2300型激光隔離DFB激光器模塊 |
| 文件頁(yè)數(shù)： | 2/8頁(yè) |
| 文件大?。?/td> | 265K |
| 代理商： | D2300 |
2
Lucent Technologies Inc.
Data Sheet
February 2000
Isolated DFB Laser Module
1.3
μ
m D2300-Type Digital
Description
The D2300-Type Digital Isolated DFB Laser Module
contains an internally cooled, InGaAsP, distributed-
feedback (DFB) laser designed for 1.3
The laser is designed to be used in OC-12/STM-4 (622
Mbits/s) and OC-48/STM-16 (2.488 Gbits/s) for long-
reach and extended-reach applications.
μ
m applications.
The device is available with an average output power of
0 dBm (3 dBm peak), which meets the SONET/SDH
standard.
Controlled Feedback
The module contains an internal optical isolator that
suppresses optical feedback in laser-based, fiber-optic
systems. Light reflected back to the laser is attenuated
a minimum of 30
dB.
Controlled Temperature
An integral thermoelectric cooler (TEC) provides stable
thermal characteristics. The TEC allows for heating and
cooling of the laser chip to maintain a temperature of
25
°
C for case temperatures from –40
The laser temperature is monitored by the internal ther-
mistor, which can be used with external circuitry to con-
trol the laser chip temperature.
°
C to +80
°
C.
Controlled Power
An internal, InGaAs, PIN photodiode functions as the
back-facet monitor. The photodiode monitors emission
from the rear facet of the laser and, when used in con-
junction with control circuitry, can control optical power
launched into the fiber. Normally, this configuration is
used in a feedback arrangement to maintain the aver-
age laser output power.
Standard Package
The laser module is fabricated in a 14-pin, hermetic,
metal/ceramic butterfly package. The package also
incorporates a bias tee that separates the dc-bias path
from the RF input. The RF input has a nominal 25
impedance. The laser module is equipped with a sin-
gle-mode fiber. The pigtail has an 8
125
μ
m cladding with a 900
μ
m core and
μ
m tight buffer coating.
Lucent Technologies Microelectronics Group optoelec-
tronic components are qualified to rigorous internal
standards that are consistent with
gies
TR-NWT-000468. All design and manufacturing
operations are
ISO
* 9001 certified. The module is fully
qualified for central office applications.
Telcordia Technolo-
*
ISO
Standardization.
is a registered trademark of The International Organization for
Pin Information
* A positive current through the thermoelectric heat pump cools the
laser.
Both leads should be grounded for optimum performance.
Top view.
Figure 1. Circuit Schematic
Pin
1
2
3
4
5
6
7
8
9
10
11
Name
Thermistor
Thermistor
Laser dc Bias (cathode) (–)
Back-facet Monitor Anode (–)
Back-facet Monitor Cathode (+)
Thermoelectric Cooler (+)*
Thermoelectric Cooler (–)*
Case Ground
Case Ground
Case Ground
Laser Anode
RF Laser Input Cathode (–)
(+)
12
13
Laser Anode
Case Ground
(+)
14
1-567
TEC
L1
160 nH
ISOLATOR
R1
20
PACKAGE
GROUNDS
–
+
+
–
–
+
–
+
7
6
5
4
3
2
1
8
9
10
11
12
13
TH
10 k
14
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