參數(shù)資料
型號： CY8C29666
廠商： Cypress Semiconductor Corp.
英文描述： Mixed Signal Array
中文描述： 混合信號陣列
文件頁數(shù)： 7/40頁
文件大?。?/td> 474K
代理商： CY8C29666
August 3, 2004
Document No. 38-12013 Rev. *F
7
CY8C29x66 Preliminary Data Sheet
PSoC Overview
Document Conventions
Acronyms Used
The following table lists the acronyms that are used in this doc-
ument.
Units of Measure
A units of measure table is located in the Electrical Specifica-
tions section.
Table 3-1 on page 17
lists all the abbreviations
used to measure the PSoC devices.
Numeric Naming
Hexidecimal numbers are represented with all letters in upper-
case with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’, ‘b’, or 0x are decimal.
Table of Contents
For an in depth discussion and more information on your PSoC
device, obtain the
PSoC Mixed Signal Array Technical Refer-
ence Manual
. This document encompasses and is organized
into the following chapters and sections.
1.
Pin Information ............................................................. 8
1.1
Pinouts ................................................................... 8
1.1.1
28-Pin Part Pinout ...................................... 8
1.1.2
44-Pin Part Pinout ...................................... 9
1.1.3
48-Pin Part Pinouts ................................... 10
1.1.4
100-Pin Part Pinout .................................. 12
2.
Register Reference ..................................................... 14
2.1
Register Conventions ........................................... 14
2.1.1
Abbreviations Used .................................. 14
2.2
Register Mapping Tables ..................................... 14
3.
Electrical Specifications ............................................ 17
3.1
Absolute Maximum Ratings ................................. 18
3.2
Operating Temperature ........................................ 18
3.3
DC Electrical Characteristics ................................ 19
3.3.1
DC Chip-Level Specifications ................... 19
3.3.2
DC General Purpose IO Specifications .... 19
3.3.3
DC Operational Amplifier Specifications ... 20
3.3.4
DC Analog Output Buffer Specifications ... 21
3.3.5
DC Switch Mode Pump Specifications ..... 22
3.3.6
DC Analog Reference Specifications ....... 23
3.3.7
DC Analog PSoC Block Specifications ..... 24
3.3.8
DC POR, SMP, and LVD Specifications ... 24
3.3.9
DC Programming Specifications ............... 25
3.4
AC Electrical Characteristics ................................ 26
3.4.1
AC Chip-Level Specifications ................... 26
3.4.2
AC General Purpose IO Specifications .... 28
3.4.3
AC Operational Amplifier Specifications ... 29
3.4.4
AC Digital Block Specifications ................. 30
3.4.5
AC Analog Output Buffer Specifications ... 31
3.4.6
AC External Clock Specifications ............. 32
3.4.7
AC Programming Specifications ............... 32
3.4.8
AC I2C Specifications ............................... 33
4.
Packaging Information ............................................... 34
4.1
Packaging Dimensions ......................................... 34
4.2
Thermal Impedances ........................................... 38
4.3
Capacitance on Crystal Pins ................................ 38
5.
Ordering Information .................................................. 39
5.1
Ordering Code Definitions .................................... 39
6.
Sales and Service Information .................................. 40
6.1
Revision History ................................................... 40
6.2
Copyrights and Code Protection .......................... 40
Acronym
Description
AC
alternating current
ADC
analog-to-digital converter
API
application programming interface
CPU
central processing unit
CT
continuous time
DAC
digital-to-analog converter
DC
direct current
ECO
external crystal oscillator
EEPROM
electrically erasable programmable read-only memory
FSR
full scale range
GPIO
general purpose IO
GUI
graphical user interface
HBM
human body model
ICE
in-circuit emulator
ILO
internal low speed oscillator
IMO
internal main oscillator
IO
input/output
IPOR
imprecise power on reset
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
PC
program counter
PLL
phase-locked loop
POR
power on reset
PPOR
precision power on reset
PSoC
Programmable System-on-Chip
PWM
pulse width modulator
RAM
random access memory
SC
switched capacitor
SLIMO
slow IMO
SMP
switch mode pump
相關(guān)PDF資料
PDF描述
CY8C29666-24PVXI Mixed Signal Array
CY8C29866 Mixed Signal Array
CY8C29466-24PXI Mixed Signal Array
CY8C29566-24AXI Mixed Signal Array
CY8C29566-24AXIT Mixed Signal Array
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY8C29666-12PVXE 功能描述:可編程片上系統(tǒng) - PSoC 44 I/O 32K Flash 2K bytes RAM RoHS:否 制造商:Cypress Semiconductor 核心:8051 處理器系列:CY8C36 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:67 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:4 KB 片上 ADC:Yes 工作電源電壓:0.5 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:QFN-68 安裝風(fēng)格:SMD/SMT
CY8C29666-12PVXET 功能描述:可編程片上系統(tǒng) - PSoC 44 I/O 32K Flash 2K bytes RAM RoHS:否 制造商:Cypress Semiconductor 核心:8051 處理器系列:CY8C36 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:67 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:4 KB 片上 ADC:Yes 工作電源電壓:0.5 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:QFN-68 安裝風(fēng)格:SMD/SMT
CY8C29666-24LFXI 功能描述:可編程片上系統(tǒng) - PSoC IC MCU 32K FLASH 2K SRAM RoHS:否 制造商:Cypress Semiconductor 核心:8051 處理器系列:CY8C36 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:67 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:4 KB 片上 ADC:Yes 工作電源電壓:0.5 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:QFN-68 安裝風(fēng)格:SMD/SMT
CY8C29666-24LFXIT 功能描述:可編程片上系統(tǒng) - PSoC 32K Flsh 2KB RAM IND RoHS:否 制造商:Cypress Semiconductor 核心:8051 處理器系列:CY8C36 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:67 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:4 KB 片上 ADC:Yes 工作電源電壓:0.5 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:QFN-68 安裝風(fēng)格:SMD/SMT
CY8C29666-24LTXI 功能描述:可編程片上系統(tǒng) - PSoC 32 KB 2048 B RoHS:否 制造商:Cypress Semiconductor 核心:8051 處理器系列:CY8C36 數(shù)據(jù)總線寬度:8 bit 最大時鐘頻率:67 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:4 KB 片上 ADC:Yes 工作電源電壓:0.5 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:QFN-68 安裝風(fēng)格:SMD/SMT
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