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參數(shù)資料
| 型號： | CY7C65640A |
| 廠商： | Cypress Semiconductor Corp. |
| 英文描述： | TetraHub High-Speed USB Hub Controller(TetraHub高速USB Hub控制器) |
| 中文描述： | TetraHub高速USB集線器控制器（TetraHub高速USB集線器控制器） |
| 文件頁數(shù)： | 19/21頁 |
| 文件大?。?/td> | 513K |
| 代理商： | CY7C65640A |
CY7C65640A
Document #: 38-08019 Rev. *H
Page 19 of 21
16.0
Package Diagrams
The TetraHub is available in a space-saving 56-pin QFN
(8 × 8 mm)
.
Note
. The bottom metal pad size varies by product due to die
size variable. If metal pad design or dimension are critical with
your board designs, please contact a Cypress Sales office to
get the specific outline option.
16.1
Design Notes
The QFN (Quad Flatpack No Leads), being a lead free
package, the electrical contact of the part to the Printed Circuit
Board (PCB) is made by soldering the lands on the bottom
surface of the package to the PCB. Hence special attention is
required to the heat transfer area below the package to provide
a good thermal bond to the circuit board. A Copper (Cu) fill
should be designed into the PCB as a thermal pad under the
package. Heat is transferred from the TetraHub through the
device’s metal paddle on the bottom side of the package. Heat
from here is conducted to the PCB at the thermal pad. It is then
conducted from the thermal pad to the PCB inner ground plane
by a 5 x 5 array of via. A via is a plated through-hole in the PCB
with a finished diameter of 13 mil. The QFN’s metal die paddle
must be soldered to the PCB’s thermal pad. Solder mask is
placed on the board top side over each via to resist solder flow
Quad Flat Package No Leads (QFN) Package
into the via. The mask on the top side also minimizes
outgassing during the solder reflow process.
Please follow the layout guidelines provided in the PCB layout
files accompanied with the CY4602 TetraHub Reference
Design Kit. The information in this section was derived from
the original application note by the package vendor. For further
information on this package design please refer to the appli-
cation note “Surface Mount Assembly of AMKOR’s
MicroLeadFrame (MLF) Technology”. This application note
can be downloaded from AMKOR’s website from the following
URL
http://www.amkor.com/products/notes_papers/MLF_AppNote
_0301.pdf.
This application note provides detailed information on board
mounting guidelines, soldering flow, rework process, etc.
Figure 16-1
below displays a cross-sectional area underneath
the package. The cross section is of only one via. The solder
Paste template needs to be designed to allow at least 50%
solder coverage. The thickness of the solder paste template
should be 5 mil. It is recommended that “No Clean”, type 3
solder paste is used for mounting the part. Nitrogen purge is
recommended during reflow.
0.80[0.031]
7.70[0.303]
7.80[0.307]
7.90[0.311]
8.10[0.319]
A
C
1.00[0.039] MAX.
N
SEATING
N
2
0.18[0.007]
0.28[0.011]
0.50[0.020]
1
1
2
0.08[0.003]
0.50[0.020]
0.05[0.002] MAX.
(4X)
C
0.24[0.009]
0.60[0.024]
0.20[0.008] REF.
0.80[0.031] MAX.
PIN1 ID
0.20[0.008] R.
0°-12°
6.45[0.254]
6.55[0.258]
0.45[0.018]
8
7
7
7
DIA.
0.30[0.012]
6
6
TOP VIEW
BOTTOM VIEW
SIDE VIEW
E-PAD
(PAD SIZE VARY
BY DEVICE TYPE)
51-85144-*D
56-Lead QFN 8 x 8 MM LF56A
Dimensions are in millimeters
MIN
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CY7C67200 | EZ-OTG Programmable USB On-The-Go Host/Peripheral Controller(EZ-OTG可編程USB On-The-Go主機/外圍設(shè)備控制器) |
| CY7C68320C | EZ-USB AT2LP USB 2.0 to ATA/ATAPI Bridge(EZ-USB AT2LP USB 2.0到ATA/ATAPI橋接器) |
| CY7C68301C | EZ-USB AT2LP USB 2.0 to ATA/ATAPI Bridge(EZ-USB AT2LP USB 2.0到ATA/ATAPI橋接器) |
| CY7C68300C | EZ-USB AT2LP USB 2.0 to ATA/ATAPI Bridge(EZ-USB AT2LP USB 2.0到ATA/ATAPI橋接器) |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C65640ALFXC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C65640A-LFXC | 功能描述:USB 接口集成電路 USB 2.0 4 Port Hub COM RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| CY7C65640A-LFXCT | 功能描述:USB 接口集成電路 USB 2.0 4 Port Hub COM RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| CY7C65640A-LTXC | 功能描述:USB 接口集成電路 USB HS Controller RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| CY7C65640A-LTXCKM | 制造商:Cypress Semiconductor 功能描述: |
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