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參數(shù)資料
| 型號(hào)： | CY7C64713 |
| 廠商： | Cypress Semiconductor Corp. |
| 英文描述： | EZ-USB FX1 USB Microcontroller Full-speed USB Peripheral Controller(EZ-USB FX1 USB微控制器，全速USB外設(shè)控制器) |
| 中文描述： | 的EZ - USB FX1的USB微控制器全速USB外設(shè)控制器（的EZ - USB FX1的的USB微控制器，全速的USB外設(shè)控制器） |
| 文件頁數(shù)： | 48/50頁 |
| 文件大?。?/td> | 1419K |
| 代理商： | CY7C64713 |
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CY7C64713/14
Document #: 38-08039 Rev. *C
Page 48 of 50
13.0
Package Design Notes
Quad Flat Package No Leads (QFN)
Electrical contact of the part to the Printed Circuit Board (PCB)
is made by soldering the leads on the bottom surface of the
package to the PCB. Hence, special attention is required to the
heat transfer area below the package to provide a good
thermal bond to the circuit board. A Copper (Cu) fill is to be
designed into the PCB as a thermal pad under the package.
Heat is transferred from the FX1 through the device’s metal
paddle on the bottom side of the package. Heat from here, is
conducted to the PCB at the thermal pad. It is then conducted
from the thermal pad to the PCB inner ground plane by a 5 x 5
array of via. A via is a plated through hole in the PCB with a
finished diameter of 13 mil. The QFN’s metal die paddle must
be soldered to the PCB’s thermal pad. Solder mask is placed
on the board top side over each via to resist solder flow into
the via. The mask on the top side also minimizes outgassing
during the solder reflow process.
For further information on this package design please refer to
the application note
Surface Mount Assembly of AMKOR’s
MicroLeadFrame (MLF) Technology
. This application note can
be downloaded from AMKOR’s website from the following
URL:
http://www.amkor.com/products/notes_papers/MLF_AppNote
_0902.pdf.
The application note provides detailed information on board
mounting guidelines, soldering flow, rework process, etc.
Figure 13-1
below displays a cross-sectional area underneath
the package. The cross section is of only one via. The solder
paste template needs to be designed to allow at least 50%
solder coverage. The thickness of the solder paste template
should be 5 mil. It is recommended that “No Clean” type 3
solder paste is used for mounting the part. Nitrogen purge is
recommended during reflow.
Figure 13-2
is a plot of the solder mask pattern and
Figure 13-
3
displays an X-Ray image of the assembly (darker areas
indicate solder).
Package Diagrams
(continued)
51-85101-*B
Figure 12-3. 128-Lead Thin Plastic Quad Flatpack (14 x 20 x 1.4 mm) A128
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| CY7C64714 | EZ-USB FX1 USB Microcontroller Full-speed USB Peripheral Controller(EZ-USB FX1 USB微控制器，全速USB外設(shè)控制器) |
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| CY7C68013A-100AXC | Hook-Up Wire; Conductor Size AWG:26; No. Strands x Strand Size:7 x 34; Jacket Color:Purple; Approval Bodies:UL, CSA; Approval Categories:UL AWM Styles 1007, 1565; CSA Types TR-64, TRSR-64; JQA-F; Passes VW-1 Flame Test RoHS Compliant: Yes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C64713-100AXC | 功能描述:8位微控制器 -MCU EZ USB FX1 LO Pwr Hi COM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| CY7C64713-128AXC | 功能描述:8位微控制器 -MCU EZ USB FX1 LO Pwr Hi COM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| CY7C64713-56LFXC | 功能描述:8位微控制器 -MCU EZ USB FX1 LO Pwr LO COM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
| CY7C64713-56LTXC | 功能描述:USB 接口集成電路 USB FS Controller RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| CY7C64713-56PVXC | 功能描述:8位微控制器 -MCU EZ USB FX1 LO Pwr LO COM RoHS:否 制造商:Silicon Labs 核心:8051 處理器系列:C8051F39x 數(shù)據(jù)總線寬度:8 bit 最大時(shí)鐘頻率:50 MHz 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:1.8 V to 3.6 V 工作溫度范圍:- 40 C to + 105 C 封裝 / 箱體:QFN-20 安裝風(fēng)格:SMD/SMT |
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