- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄379085 > CY7C1518AV18-278BZC (CYPRESS SEMICONDUCTOR CORP) 72-Mbit DDR-II SRAM 2-Word Burst Architecture PDF資料下載
參數(shù)資料
| 型號： | CY7C1518AV18-278BZC |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 72-Mbit DDR-II SRAM 2-Word Burst Architecture |
| 中文描述： | 4M X 18 DDR SRAM, 0.45 ns, PBGA165 |
| 封裝： | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 |
| 文件頁數(shù)： | 11/28頁 |
| 文件大小： | 1133K |
| 代理商： | CY7C1518AV18-278BZC |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁當(dāng)前第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁
PRELIMINARY
CY7C1516AV18
CY7C1527AV18
CY7C1518AV18
CY7C1520AV18
Document #: 001-06982 Rev. *B
Page 11 of 28
Write Cycle Descriptions
[3, 9]
(CY7C1520AV18)
BWS
0
L
BWS
1
L
BWS
2
L
BWS
3
L
K
K
–
Comments
L-H
During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are
written into the device.
During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are
written into the device.
During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is
written into the device. D
[35:9]
will remain unaltered.
During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is
written into the device. D
[35:9]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[17:9]
) is
written into the device. D
[8:0]
and D
[35:18]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[17:9]
) is
written into the device. D
[8:0]
and D
[35:18]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[26:18]
) is
written into the device. D
[17:0]
and D
[35:27]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[26:18]
) is
written into the device. D
[17:0]
and D
[35:27]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[35:27]
) is
written into the device. D
[26:0]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[35:27]
) is
written into the device. D
[26:0]
will remain unaltered.
No data is written into the device during this portion of a Write operation.
No data is written into the device during this portion of a Write operation.
L
L
L
L
–
L-H
L
H
H
H
L-H
–
L
H
H
H
–
L-H
H
L
H
H
L-H
–
H
L
H
H
–
L-H
H
H
L
H
L-H
–
H
H
L
H
–
L-H
H
H
H
L
L-H
H
H
H
L
–
L-H
H
H
H
H
H
H
H
H
L-H
–
–
L-H
[+] Feedback
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CY7C1518AV18-278BZI | 72-Mbit DDR-II SRAM 2-Word Burst Architecture |
| CY7C1518AV18-278BZXC | 72-Mbit DDR-II SRAM 2-Word Burst Architecture |
| CY7C1518AV18-278BZXI | 72-Mbit DDR-II SRAM 2-Word Burst Architecture |
| CY7C1518AV18-300BZC | 72-Mbit DDR-II SRAM 2-Word Burst Architecture |
| CY7C1518AV18-300BZI | 72-Mbit DDR-II SRAM 2-Word Burst Architecture |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1518BC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1518JV18-250BZC | 功能描述:靜態(tài)隨機(jī)存取存儲器 4M x 18 1.8V DDR-II 靜態(tài)隨機(jī)存取存儲器 (TWO-WRD BURST) RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1518JV18-300BZC | 功能描述:靜態(tài)隨機(jī)存取存儲器 4M x 18 1.8V DDR-II (2-Word Burst) RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1518JV18-300BZXC | 功能描述:靜態(tài)隨機(jī)存取存儲器 4M x 18 1.8V DDR-II (2-Word Burst) RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1518JV18-312BZC | 功能描述:IC SRAM 4MX18 DDRII 165-FBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR) |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。