參數(shù)資料
型號(hào)： CY7C1473V25-133BZC
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： DRAM
英文描述： 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture
中文描述： 4M X 18 ZBT SRAM, 6.5 ns, PBGA165
封裝： 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165
文件頁數(shù)： 17/30頁
文件大?。?/td> 373K
代理商： CY7C1473V25-133BZC
PRELIMINARY
CY7C1471V25
CY7C1473V25
CY7C1475V25
Document #: 38-05287 Rev. *E
Page 17 of 30
Scan Register Sizes
Register Name
Bit Size (x36)
3
1
32
71
-
Bit Size (x18)
3
1
32
52
-
Bit Size (x72)
3
1
32
-
110
Instruction
Bypass
ID
Boundary Scan Order-165FBGA
Boundary Scan Order- 209BGA
Identification Codes
Instruction
Code
000
Description
EXTEST
Captures I/O ring contents. Places the boundary scan register between TDI and
TDO. Forces all SRAM outputs to High-Z state. This instruction is not 1149.1
compliant.
Loads the ID register with the vendor ID code and places the register between TDI
and TDO. This operation does not affect SRAM operations.
Captures I/O ring contents. Places the boundary scan register between TDI and
TDO. Forces all SRAM output drivers to a High-Z state.
Do Not Use: This instruction is reserved for future use.
Captures I/O ring contents. Places the boundary scan register between TDI and
TDO. Does not affect SRAM operation. This instruction does not implement 1149.1
preload function and is therefore not 1149.1 compliant.
Do Not Use: This instruction is reserved for future use.
Do Not Use: This instruction is reserved for future use.
Places the bypass register between TDI and TDO. This operation does not affect
SRAM operation.
IDCODE
001
SAMPLE Z
010
RESERVED
SAMPLE/PRELOAD
011
100
RESERVED
RESERVED
BYPASS
101
110
111
相關(guān)PDF資料
PDF描述
CY7C1473V25-133BZXC 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture
CY7C1471V25-100BZC 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture
CY7C1471V25-100BZXC 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture
CY7C1471V25-133AXC 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture
CY7C1471V25-133BZC 72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1474BV25-167BGC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 1Mx72, 2.5V NoBL PL RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1474BV25-167BGCT 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 1Mx72, 2.5V NoBL PL RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1474BV25-167BGI 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 1Mx72, 2.5V NoBL PL RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1474BV25-167BGIT 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 1Mx72 2.5V NoBL PL 靜態(tài)隨機(jī)存取存儲(chǔ)器 RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1474BV25-200BGC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 1Mx72, 2.5V NoBL PL RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
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