- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄379075 > CY7C1418BV18-200BZXI (CYPRESS SEMICONDUCTOR CORP) 36-Mbit DDR-II SRAM 2-Word Burst Architecture PDF資料下載
參數(shù)資料
| 型號： | CY7C1418BV18-200BZXI |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 36-Mbit DDR-II SRAM 2-Word Burst Architecture |
| 中文描述： | 2M X 18 DDR SRAM, 0.45 ns, PBGA165 |
| 封裝： | 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 |
| 文件頁數(shù)： | 9/28頁 |
| 文件大?。?/td> | 1132K |
| 代理商： | CY7C1418BV18-200BZXI |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁當前第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁
PRELIMINARY
CY7C1416BV18
CY7C1427BV18
CY7C1418BV18
CY7C1420BV18
Document Number: 001-07033 Rev. *B
Page 9 of 28
Application Example
[1]
Truth Table for DDR-II
[2, 3, 4, 5, 6, 7]
Operation
K
LD
L
R/W
L
DQ
DQ
Write Cycle:
Load address; wait one cycle; input write data on
consecutive K and K rising edges.
Read Cycle:
Load address; wait one and a half cycle; read data on
consecutive C and C rising edges.
NOP: No Operation
Standby: Clock Stopped
L-H
D(A) at K(t + 1)
↑
D(A + 1) at K(t + 1)
↑
L-H
L
H
Q(A) at C(t + 1)
↑
Q(A + 1) at C(t + 2)
↑
L-H
H
X
X
X
High-Z
Previous State
High-Z
Previous State
Stopped
Burst Address Table
(CY7C1427BV18, CY7C1418BV18)
First Address (External)
X..X0
X..X1
Second Address (Internal)
X..X1
X..X0
Notes:
1. The above application shows two DDR-II used.
2. X = “Don’t Care,” H = Logic HIGH, L = Logic LOW,
↑
represents rising edge.
3. Device will power-up deselected and the outputs in a tri-state condition.
4. On CY7C1418BV18 and CY7C1420BV18, “A” represents address location latched by the devices when transaction was initiated and A + 1 represents the
addresses sequence in the burst. On CY7C1416BV18 and CY7C1427BV18 “A” represents A + ‘0’ and A2 represents A + ‘1’.
5. “t” represents the cycle at which a Read/Write operation is started. t + 1 and t + 2 are the first and second clock cycles succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.
7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line
charging symmetrically.
LD#
Vterm = 0.75V
Vterm = 0.75V
C C#
R/W#
ZQ
CQ/CQ#
K#
DQ
A
LD#
C C#
R/W#
ZQ
CQ/CQ#
K#
DQ
A
BUS
MASTER
(CPU
or
ASIC)
SRAM#1
SRAM#2
DQ
Addresses
Cycle Start#
R/W#
Return CLK
Source CLK
Return CLK#
Source CLK#
Echo Clock1/Echo Clock#1
Echo Clock2/Echo Clock#2
R = 50
ohms
R = 250
ohms
R
= 250ohms
[+] Feedback
相關PDF資料 |
PDF描述 |
|---|---|
| CY7C1418BV18-250BZC | 36-Mbit DDR-II SRAM 2-Word Burst Architecture |
| CY7C1418BV18-250BZI | 36-Mbit DDR-II SRAM 2-Word Burst Architecture |
| CY7C1418BV18-250BZXC | 36-Mbit DDR-II SRAM 2-Word Burst Architecture |
| CY7C1418BV18-250BZXI | 36-Mbit DDR-II SRAM 2-Word Burst Architecture |
| CY7C1418BV18-278BZC | 36-Mbit DDR-II SRAM 2-Word Burst Architecture |
相關代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1418BV18-250BZC | 功能描述:靜態(tài)隨機存取存儲器 2Mx18 DDR II Burst 2 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1418BV18-250BZI | 功能描述:靜態(tài)隨機存取存儲器 2Mx18 DDR-II Burst 2 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1418BV18-250BZXC | 功能描述:靜態(tài)隨機存取存儲器 2Mx18 DDR II Burst 2 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1418BV18-267BZXC | 功能描述:靜態(tài)隨機存取存儲器 2Mx18 DDR-II Burst 2 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1418JV18-300BZC | 功能描述:靜態(tài)隨機存取存儲器 2Mx18 DDR II Burst 2 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
發(fā)布緊急采購，3分鐘左右您將得到回復。