參數(shù)資料
型號: CY7C1416AV18_06
廠商: Cypress Semiconductor Corp.
英文描述: 36-Mbit DDR-II SRAM 2-Word Burst Architecture
中文描述: 36兆位的DDR - II SRAM的2字突發(fā)結(jié)構(gòu)
文件頁數(shù): 11/28頁
文件大小: 456K
代理商: CY7C1416AV18_06
CY7C1416AV18
CY7C1427AV18
CY7C1418AV18
CY7C1420AV18
Document Number: 38-05616 Rev. *D
Page 11 of 28
Write Cycle Descriptions
(CY7C1418AV18)
[2, 8]
BWS
0
L
BWS
1
L
BWS
2
L
BWS
3
L
K
K
Comments
L-H
During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are
written into the device.
During the Data portion of a Write sequence, all four bytes (D
[35:0]
) are
written into the device.
During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is
written into the device. D
[35:9]
will remain unaltered.
During the Data portion of a Write sequence, only the lower byte (D
[8:0]
) is
written into the device. D
[35:9]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[17:9]
) is
written into the device. D
[8:0]
and D
[35:18]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[17:9]
) is
written into the device. D
[8:0]
and D
[35:18]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[26:18]
) is
written into the device. D
[17:0]
and D
[35:27]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[26:18]
) is
written into the device. D
[17:0]
and D
[35:27]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[35:27]
) is
written into the device. D
[26:0]
will remain unaltered.
During the Data portion of a Write sequence, only the byte (D
[35:27]
) is
written into the device. D
[26:0]
will remain unaltered.
No data is written into the device during this portion of a Write operation.
No data is written into the device during this portion of a Write operation.
L
L
L
L
L-H
L
H
H
H
L-H
L
H
H
H
L-H
H
L
H
H
L-H
H
L
H
H
L-H
H
H
L
H
L-H
H
H
L
H
L-H
H
H
H
L
L-H
H
H
H
L
L-H
H
H
H
H
H
H
H
H
L-H
L-H
Write Cycle Descriptions
(CY7C1420AV18)
[2, 8]
BWS
0
L
K
K
Comments
L-H
During the Data portion of a Write sequence
,
the single byte (D
[8:0]
) is written into the device.
During the Data portion of a Write sequence
,
the single byte (D
[8:0]
) is written into the device.
No data is written into the device during this portion of a Write operation.
No data is written into the device during this portion of a Write operation.
L
L-H
H
H
L-H
L-H
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相關(guān)PDF資料
PDF描述
CY7C1416AV18-167BZC 36-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1416AV18-167BZI 36-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1416AV18-167BZXC 36-Mbit DDR-II SRAM 2-Word Burst Architecture
CY7C1416AV18-167BZXI 36-Mbit DDR-II SRAM 2-Word Burst Architecture
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參數(shù)描述
CY7C1418AV18-167BZC 功能描述:靜態(tài)隨機(jī)存取存儲器 2Mx18 DDR II Burst 2 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1418AV18-167BZCES 制造商:Cypress Semiconductor 功能描述:SRAM SYNC SGL 1.8V 36MBIT 2MX18 0.5NS 165FBGA - Bulk
CY7C1418AV18-167BZXC 功能描述:靜態(tài)隨機(jī)存取存儲器 2Mx18 DDR II Burst 2 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1418AV18-200BZCES 制造商:Cypress Semiconductor 功能描述:SRAM SYNC SGL 1.8V 36MBIT 2MX18 0.45NS 165FBGA - Bulk
CY7C1418AV18-200BZXC 功能描述:靜態(tài)隨機(jī)存取存儲器 2Mx18 DDR II Burst 2 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray