參數(shù)資料
型號: CY7C1411AV18-278BZXI
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 36-Mbit QDR⑩-II SRAM 4-Word Burst Architecture
中文描述: 4M X 8 QDR SRAM, 0.45 ns, PBGA165
封裝: 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
文件頁數(shù): 21/28頁
文件大?。?/td> 1143K
代理商: CY7C1411AV18-278BZXI
CY7C1411AV18
CY7C1426AV18
CY7C1413AV18
CY7C1415AV18
Document Number: 38-05614 Rev. *C
Page 21 of 28
Capacitance
[23]
Parameter
C
IN
C
CLK
C
O
Description
Test Conditions
Max.
5
4
5
Unit
pF
pF
pF
Input Capacitance
Clock Input Capacitance
Output Capacitance
T
A
= 25
°
C, f = 1 MHz,
V
DD
= 1.8V
V
DDQ
= 1.5V
Thermal Resistance
[23]
Parameter
Θ
JA
Description
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
Test Conditions
165 FBGA
Package
17.2
Unit
°C/W
Test conditions follow standard test methods and procedures for
measuring thermal impedance, per EIA/JESD51.
Θ
JC
3.2
°C/W
AC Test Loads and Waveforms
Notes:
23.Tested initially and after any design or process change that may affect these parameters.
24.Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250
, V
DDQ
= 1.5V, input
pulse levels of 0.25V to 1.25V, and output loading of the specified I
OL
/I
OH
and load capacitance shown in (a) of AC Test Loads.
1.25V
0.25V
R = 50
5 pF
ALL INPUT PULSES
Device
Under
Test
R
L
= 50
Z
0
= 50
V
REF
= 0.75V
V
REF
= 0.75V
[24]
0.75V
0.75V
Device
Under
Test
OUTPUT
0.75V
V
REF
V
REF
OUTPUT
ZQ
ZQ
(a)
Slew Rate = 2 V/ns
RQ =
250
(b)
RQ =
250
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