參數(shù)資料
型號: CY7C1387C-200BZC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 18-Mb (512K x 36/1M x 18) Pipelined DCD Sync SRAM
中文描述: 1M X 18 CACHE SRAM, 3 ns, PBGA165
封裝: 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
文件頁數(shù): 30/34頁
文件大?。?/td> 554K
代理商: CY7C1387C-200BZC
CY7C1386C
CY7C1387C
Document #: 38-05239 Rev. *B
Page 30 of 34
Ordering Information
Speed
(MHz)
250
Ordering Code
CY7C1386C-250AC
CY7C1387C-250AC
CY7C1386C-250BGC
CY7C1387C-250BGC
CY7C1386C-250BZC
CY7C1387C-250BZC
CY7C1386C-225AC
CY7C1387C-225AC
CY7C1386C-225AI
CY7C1387C-225AI
CY7C1386C-225BGC
CY7C1387C-225BGC
CY7C1386C-225BGI
CY7C1387C-225BGI
CY7C1386C-225BZC
CY7C1387C-225BZC
CY7C1386C-225BZI
CY7C1387C-225BZI
CY7C1386C-200AC
CY7C1387C-200AC
CY7C1386C-200AI
CY7C1387C-200AI
CY7C1386C-200BGC
CY7C1387C-200BGC
CY7C1386C-200BGI
CY7C1387C-200BGI
CY7C1386C-200BZC
CY7C1387C-200BZC
CY7C1386C-200BZI
CY7C1387C-200BZI
CY7C1386C-167AC
CY7C1387C-167AC
CY7C1386C-167AI
CY7C1387C-167AI
CY7C1386C-167BGC
CY7C1387C-167BGC
CY7C1386C-167BG
ICY7C1387C-167BGI
CY7C1386C-167BZC
CY7C1387C-167BGC
CY7C1386C-167BZI
CY7C1387C-167BGI
Package
Name
A101
Part and Package Type
Operating
Range
Commercial
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
119-ball (14 x 22 x 2.4 mm)
BGA 2 Chip Enables with
JTAG
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables with JTAG
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
BG119
BB165A
225
A101
Commercial
Industrial
BG119
119-ball (14 x 22 x 2.4 mm)
BGA 2 Chip Enables with
JTAG
Commercial
Industrial
BB165A
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables with JTAG
Commercial
Industrial
200
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
Commercial
Industrial
BG119
119-ball (14 x 22 x 2.4 mm)
BGA 2 Chip Enables with
JTAG
Commercial
Industrial
BB165A
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables with JTAG
Commercial
Industrial
167
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4mm)
3 Chip Enables
Commercial
Industrial
BG119
119-ball (14 x 22 x 2.4 mm)
BGA 2 Chip Enables with
JTAG
Commercial
Industrial
BB165A
165-ball Fine-Pitch Ball Grid Array (13 x 15 x 1.2mm)
3 Chip Enables with JTAG
Commercial
Industrial
Shaded areas contain advance information.
Please contact your local sales representative for availability of these parts.
相關(guān)PDF資料
PDF描述
CY7C1387C-200BZI 18-Mb (512K x 36/1M x 18) Pipelined DCD Sync SRAM
CY7C1387C-225AC 18-Mb (512K x 36/1M x 18) Pipelined DCD Sync SRAM
CY7C1387C-225AI 18-Mb (512K x 36/1M x 18) Pipelined DCD Sync SRAM
CY7C1387C-225BGC 18-Mb (512K x 36/1M x 18) Pipelined DCD Sync SRAM
CY7C1387C-225BGI 18-Mb (512K x 36/1M x 18) Pipelined DCD Sync SRAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1387D-167AXC 功能描述:靜態(tài)隨機存取存儲器 1Mx18 3.3V COM 2CD Sync PL 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1387D-167AXCKJ 制造商:Cypress Semiconductor 功能描述:
CY7C1387D-167AXCT 功能描述:靜態(tài)隨機存取存儲器 1Mx18 3.3V COM 2CD Sync PL 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1387D-167BZI 功能描述:靜態(tài)隨機存取存儲器 18Mb (1Mb x 18) 靜態(tài)隨機存取存儲器 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C138XC 制造商:Cypress Semiconductor 功能描述: