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參數(shù)資料
| 型號： | CY7C1386F-200BGI |
| 廠商： | Cypress Semiconductor Corp. |
| 英文描述： | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
| 中文描述： | 18兆位（為512k × 36 / 1兆位× 18）流水線雙氰胺同步靜態(tài)存儲器 |
| 文件頁數(shù)： | 29/30頁 |
| 文件大?。?/td> | 974K |
| 代理商： | CY7C1386F-200BGI |
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CY7C1386D, CY7C1386F
CY7C1387D, CY7C1387F
Document Number: 38-05545 Rev. *E
Cypress Semiconductor Corporation, 2006-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for
the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended
to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Page 29 of 30
Intel and Pentium are registered trademarks, and i486 is a trademark of Intel Corporation. PowerPC is a trademark of IBM
Corporation. All product and company names mentioned in this document are the trademarks of their respective holders.
Figure 3. 165-Ball FBGA (13 x 15 x 1.4 mm) (51-85180)
Package Diagrams
(continued)
A
1
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (165X)
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
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9
10
10.00
1
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A
A
1
13.00±0.10
B
C
1
5.00
10.00
0
PACKAGE WEIGHT : 0.475g
PACKAGE CODE : BB0AC
51-85180-*A
A
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (0.25 M C A B
0.25 M0.05 M C
0.05 M C
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
5
6
7
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9
10
1
B
C
D
E
F
G
H
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K
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B
A
A
1
13.00±0.10
B
C
1
5.00
0
1
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
51-85180-*A
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相關PDF資料 |
PDF描述 |
|---|---|
| CY7C1386F-200BGXC | Replacement for Intersil part number 84067022A. Buy from authorized manufacturer Rochester Electronics. |
| CY7C1386F-200BGXI | Replacement for Intersil part number 8406702RA. Buy from authorized manufacturer Rochester Electronics. |
| CY7C1386F-250BGC | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
| CY7C1386F-250BGI | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
| CY7C1386F-250BGXC | 18-Mbit (512K x 36/1 Mbit x 18) Pipelined DCD Sync SRAM |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1386S-167AXC | 功能描述:靜態(tài)隨機存取存儲器 CY7C1386S-167AXC RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1386S-167AXCKJ | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1387B-150AC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1387B-150BGC | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Cypress Semiconductor 功能描述: |
| CY7C1387BV25-150AC | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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