參數(shù)資料
型號(hào): CY7C1380C-200AC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 18-Mb (512K x 36/1M x 18) Pipelined SRAM
中文描述: 512K X 36 CACHE SRAM, 3 ns, PQFP100
封裝: 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
文件頁(yè)數(shù): 10/36頁(yè)
文件大?。?/td> 788K
代理商: CY7C1380C-200AC
CY7C1380C
CY7C1382C
Document #: 38-05237 Rev. *D
Page 10 of 36
ADSP
84
A4
B9
Input-
Synchronous
Address Strobe from Processor, sampled on
the rising edge of CLK, active LOW
. When
asserted LOW, addresses presented to the device
are captured in the address registers. A1: A0 are
also loaded into the burst counter. When ADSP and
ADSC are both asserted, only ADSP is recognized.
ASDP is ignored when CE
1
is deasserted HIGH.
ADSC
85
P4
A8
Input-
Synchronous
Address Strobe from Controller, sampled on the
rising edge of CLK, active LOW
. When asserted
LOW, addresses presented to the device are
captured in the address registers. A1: A0 are also
loaded into the burst counter. When ADSP and
ADSC are both asserted, only ADSP is recognized.
ZZ
64
T7
H11
Input-
Asynchronous
ZZ “sleep” Input, active HIGH
. When asserted
HIGH places the device in a non-time-critical
“sleep” condition with data integrity preserved. For
normal operation, this pin has to be LOW or left
floating. ZZ pin has an internal pull-down.
DQs,
DQPs
58,59,62,
63,68,69,
72,73,8,9,
12,13,18,
19,22,23,
74,24
P7,K7,
G7,E7,
F6,H6,L6,N6,
D1,
H1,L1,
N1,E2,
G2,K2,
M2,D6,
P2
J10,K10,
L10,M10,
D11,E11,
F11,G11,J1,K1
,L1,M1,D2,E2,
F2,
G2,C11,N1
I/O-
Synchronous
Bidirectional Data I/O lines
. As inputs, they feed
into an on-chip data register that is triggered by the
rising edge of CLK. As outputs, they deliver the data
contained in the memory location specified by the
addresses presented during the previous clock rise
of the read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the
pins behave as outputs. When HIGH, DQs and
DQP
X
are placed in a tri-state condition.
Power Supply
Power supply inputs to the core of the device
.
V
DD
15,41,65,
91
C4,J2,J4,J6,
R4
D4,D8,E4,E8,
F4,F8,
G4,G8,H4,
H8,J4,J8,
K4,K8,L4,
L8,M4,M8
V
SS
17,40,67,
90
D3,D5,
E5,E3,F3,F5,
G5,
H3,H5,
K3,K5,L3,M3,
M5,
N3,N5,
P3,P5
H2,C4,C5,C6,
C7,C8,D5,D6,
D7,E5,E6,E7,
F5,F6,F7,
G5,G6,G7,
H5,H6,H7,J5,J
6,J7,
K5,K6,K7,
L5,L6,L7,
M5,M6,M7,N4,
N8
Ground
Ground for the core of the device
.
V
SSQ
5,10,21,26,55,
60,71,
76
-
-
I/O Ground
Ground for the I/O circuitry
.
CY7C1382C:Pin Definitions
(continued)
Name
TQFP
BGA
fBGA
I/O
Description
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