參數(shù)資料
型號: CY7C1372C-225BGI
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
中文描述: 1M X 18 ZBT SRAM, 2.8 ns, PBGA119
封裝: 14 X 22 MM, 2.40 MM HEIGHT, PLASTIC, BGA-119
文件頁數(shù): 16/27頁
文件大?。?/td> 704K
代理商: CY7C1372C-225BGI
CY7C1370C
CY7C1372C
Document #: 38-05233 Rev. *D
Page 16 of 27
119-ball BGA Boundary Scan Orde
r
CY7C1370C (512K x 36)
Ball ID
K4
H4
M4
F4
B4
A4
G4
C6
A6
D6
D7
E6
G6
H7
E7
F6
G7
Bit#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Bit#
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
Ball ID
P4
N4
R6
T5
T3
R2
R3
P2
P1
N2
L2
K1
N1
M2
L1
K2
Not Bonded
(Preset to 1)
H1
G2
E2
D1
H2
G1
F2
E1
D2
A5
A3
E4
B2
L3
G3
G5
L5
B6
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
H6
T7
K7
L6
N6
P7
K6
L7
M6
N7
P6
B5
B3
C5
C3
C2
A2
T4
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
CY7C1372C (1M x 18)
Ball ID
K4
H4
M4
F4
B4
A4
G4
Bit#
1
2
3
4
5
6
7
Bit#
37
38
39
40
36
41
42
Ball ID
N4
R6
T5
T3
P4
R2
R3
8
C6
43
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
P2
9
A6
44
10
T6
45
11
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
D6
E7
F6
G7
46
12
47
13
48
N1
14
15
16
17
49
50
51
52
M2
L1
K2
Not Bonded
(Preset to 1)
H1
G2
E2
D1
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
18
19
20
21
22
H6
T7
K7
L6
N6
53
54
55
56
57
23
P7
58
24
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
Not Bonded
(Preset to 0)
B5
B3
C5
59
25
60
26
61
Not Bonded
(Preset to 0)
27
62
A5
28
63
A3
29
30
31
64
65
66
E4
B2
Not Bonded
(Preset to 0)
G3
Not Bonded
(Preset to 0)
L5
B6
32
33
C3
C2
67
68
34
35
A2
T2
69
70
相關(guān)PDF資料
PDF描述
CY7C1372C-225BZC 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-225BZI 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-250AC 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-250AI 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372C-250BGC 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1372CV25-167BZC 制造商:Cypress Semiconductor 功能描述:
CY7C1372D-167AXC 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 3.3V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1372D-167AXCT 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 3.3V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1372D-167AXI 功能描述:靜態(tài)隨機(jī)存取存儲器 1Mx18 3.3V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲器 IND RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1372D-167AXIKJ 制造商:Cypress Semiconductor 功能描述: