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參數(shù)資料
| 型號(hào)： | CY7C1370C-200BZI |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| 中文描述： | 512K X 36 ZBT SRAM, 3 ns, PBGA165 |
| 封裝： | 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 |
| 文件頁(yè)數(shù)： | 23/27頁(yè) |
| 文件大?。?/td> | 704K |
| 代理商： | CY7C1370C-200BZI |
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CY7C1370C
CY7C1372C
Document #: 38-05233 Rev. *D
Page 23 of 27
250
CY7C1370C-250AI
CY7C1372C-250AI
CY7C1370C-250BGI
CY7C1372C-250BGI
CY7C1370C-250BZI
CY7C1372C-250BZI
CY7C1370C-225AI
CY7C1372C-225AI
CY7C1370C-225BGI
CY7C1372C-225BGI
CY7C1370C-225BZI
CY7C1372C-225BZI
CY7C1370C-200AI
CY7C1372C-200AI
CY7C1370C-200BGI
CY7C1372C-200BGI
CY7C1370C-200BZI
CY7C1372C-200BZI
CY7C1370C-167AI
CY7C1372C-167AI
CY7C1370C-167BGI
CY7C1372C-167BGI
CY7C1370C-167BZI
CY7C1372C-167BZI
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
Industrial
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
BB165A
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.2 mm)
225
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
BB165A
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.2 mm)
200
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
BB165A
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.2 mm)
167
A101
100-lead Thin Quad Flat Pack (14 x 20 x 1.4 mm)
BG119
119-ball Ball Grid Array (14 x 22 x 2.4 mm)
BB165A
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.2 mm)
Shaded areas contain advance information. Please contact your local Cypress sales representative for availability of these parts.
Ordering Information
(continued)
Speed
(MHz)
Ordering Code
Package
Name
Package Type
Operating
Range
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CY7C1370C-225AC | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1370C-225AI | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1370C-225BGC | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1370C-225BGI | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
| CY7C1370C-225BZI | 512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C1370CV25-133AC | 制造商:Cypress Semiconductor 功能描述:16MB (512KX36) 2.5V NOBL-PIPE SRAM - Bulk |
| CY7C1370CV25-167AC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1370CV25167BZC | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1370CV25-167BZI | 制造商:Cypress Semiconductor 功能描述: |
| CY7C1370D-167AXC | 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 512Kx36 3.3V NoBL Sync PL 靜態(tài)隨機(jī)存取存儲(chǔ)器 COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
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