參數(shù)資料
型號: CY7C1360B
廠商: Cypress Semiconductor Corp.
英文描述: BACKSHELL, MDR, 36WAY, SCREW; For use with:Mini D Ribbon Connectors; Material:Glass Reinforced Polyester (PBT); Colour:Black; Connector type:Backshell; Flammability rating:UL94V-0; Temp, op. max:85(degree C); Temp, op. min:-20(degree RoHS Compliant: Yes
中文描述: 9兆位(256 × 36/512K × 18)流水線的SRAM
文件頁數(shù): 10/34頁
文件大?。?/td> 895K
代理商: CY7C1360B
CY7C1360B
CY7C1362B
Document #: 38-05291 Rev. *C
Page 10 of 34
ADSP
84
84
A4
B9
Input-
Synchronous
Address Strobe from Processor, sampled on
the rising edge of CLK, active LOW
. When
asserted LOW, addresses presented to the device
are captured in the address registers. A
1
, A
0
are
also loaded into the burst counter. When ADSP
and ADSC are both asserted, only ADSP is recog-
nized. ASDP is ignored when CE
1
is deasserted
HIGH.
ADSC
85
85
P4
A8
Input-
Synchronous
Address Strobe from Controller, sampled on
the rising edge of CLK, active LOW
. When
asserted LOW, addresses presented to the device
are captured in the address registers. A
1
, A
0
are
also loaded into the burst counter. When ADSP
and ADSC are both asserted, only ADSP is recog-
nized.
ZZ
64
64
T7
H11
Input-
Asynchronous
ZZ “Sleep” Input, active HIGH
. When asserted
HIGH places the device in a non-time-critical
“sleep” condition with data integrity preserved. For
normal operation, this pin has to be LOW or left
floating. ZZ pin has an internal pull-down.
DQs,
DQPs
58,59,62,
63,68,69,
72,73,8,9,
12,13,18,
19,22,23,
74,24
58,59,62,
63,68,69,
72,73,8,9,
12,13,18,
19,22,23,
74,24
P7,K7,
G7,E7,
F6,H6,L6,
N6,D1,
H1,L1,
N1,E2,
G2,K2,
M2,D6,
P2
J10,K10,
L10,M10,
D11,E11,
F11,G11,J1,
K1,L1,M1,D
2,E2,F2,
G2,C11,N1
I/O-
Synchronous
Bidirectional Data I/O lines
. As inputs, they feed
into an on-chip data register that is triggered by the
rising edge of CLK. As outputs, they deliver the
data contained in the memory location specified by
the addresses presented during the previous clock
rise of the a Read cycle. The direction of the pins
is controlled by OE. When OE is asserted LOW,
the pins behave as outputs. When HIGH, DQs and
DQP
X
are placed in a three-state condition.
Power Supply
Power supply inputs to the core of the device
.
V
DD
15,41,65,
91
15,41,65,
91
C4,J2,J4,
J6,R4
D4,D8,E4,E
8,F4,F8,
G4,G8,H4,
H8,J4,J8,
K4,K8,L4,
L8,M4,M8
V
SS
17,40,67,
90
17,40,67,
90
D3,D5,
E5,E3,F3,
F5,G5,
H3,H5,
K3,K5,L3,
M3,M5,
N3,N5,
P3,P5
H2,C4,C5,
C6,C7,C8,
D5,D6,D7,E
5,E6,E7,
F5,F6,F7,
G5,G6,G7,
H5,H6,H7,J
5,J6,J7,
K5,K6,K7,
L5,L6,L7,
M5,M6,M7,
N4,N8
Ground
Ground for the core of the device
.
V
SSQ
5,10,21,26,
55,60,71,
76
5,10,21,26,
55,60,71,
76
-
-
I/O Ground
Ground for the I/O circuitry
.
CY7C1362B–Pin Definitions
(continued)
Name
TQFP
3-Chip
Enable
TQFP
2-Chip
Enable
BGA
fBGA
I/O
Description
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