參數(shù)資料
型號: CY7C1360B-225AJC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: BACKSHELL, MDR, 36WAY, METAL; For use with:Mini D Ribbon 101XX-6000 EC Plug Connectors; Material:Aluminum; Colour:Steel; Connector type:Backshell; Ways, No. of:36 RoHS Compliant: Yes
中文描述: 256K X 36 CACHE SRAM, 2.8 ns, PQFP100
封裝: 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
文件頁數(shù): 7/34頁
文件大?。?/td> 895K
代理商: CY7C1360B-225AJC
CY7C1360B
CY7C1362B
Document #: 38-05291 Rev. *C
Page 7 of 34
ADSP
84
84
A4
B9
Input-
Synchronous
Address Strobe from Processor, sampled on
the rising edge of CLK, active LOW
. When
asserted LOW, addresses presented to the device
are captured in the address registers. A
1
, A
0
are
also loaded into the burst counter. When ADSP and
ADSC are both asserted, only ADSP is recognized.
ASDP is ignored when CE
1
is deasserted HIGH.
ADSC
85
85
B4
A8
Input-
Synchronous
Address Strobe from Controller, sampled on the
rising edge of CLK, active LOW
. When asserted
LOW, addresses presented to the device are
captured in the address registers. A
1
, A
0
are also
loaded into the burst counter. When ADSP and
ADSC are both asserted, only ADSP is recognized.
ZZ
64
64
T7
H11
Input-
Asynchro-
nous
ZZ “Sleep” Input, active HIGH
. When asserted
HIGH places the device in a non-time-critical
“sleep” condition with data integrity preserved. For
normal operation, this pin has to be LOW or left
floating. ZZ pin has an internal pull-down.
DQs,
DQPs
52,53,56,
57,58,59,
62,63,68,
69,72,73,
74,75,78,
79,2,3,6,7,
8,9,12,13,1
8,19,22,
23,24,25,
28,29,51,
80,1,30
52,53,56,
57,58,59,
62,63,68,
69,72,73,
74,75,78,
79,2,3,6,7,
8,9,12,13,1
8,19,22,
23,24,25,
28,29,51,
80,1,30
K6,L6,
M6,N6,
K7,L7,
N7,P7,
E6,F6,
G6,H6,
D7,E7,
G7,H7,
D1,E1,
G1,H1,
E2,F2,
G2,H2,
K1,L1,
N1,P1,
K2,L2,
M2,N2,
P6,D6,
D2,P2
M11,L11,
K11,J11,
J10,K10,
L10,M10,
D10,E10,
F10,G10,
D11,E11,
F11,G11,
D1,E1,F1,
G1,D2,E2,
F2,G2,J1,
K1,L1,M1,
J2,K2,L2,
M2,N11,
C11,C1,N1
I/O-
Synchronous
Bidirectional Data I/O lines
. As inputs, they feed
into an on-chip data register that is triggered by the
rising edge of CLK. As outputs, they deliver the data
contained in the memory location specified by the
addresses presented during the previous clock rise
of the read cycle. The direction of the pins is
controlled by OE. When OE is asserted LOW, the
pins behave as outputs. When HIGH, DQs and
DQP
X
are placed in a three-state condition.
V
DD
15,41,65,
91
15,41,65,
91
J2,C4,J4,
R4,J6
D4,D8,E4,
E8,F4,F8,
G4,G8,H4,
H8,J4,J8,
K4,K8,L4,
L8,M4,M8
Power Supply
Power supply inputs to the core of the device
.
V
SS
17,40,67,
90
17,40,67,
90
D3,E3,
F3,H3,
K3,M3,
N3,P3,
D5,E5,
F5,H5,
K5,M5,
N5,P5
C4,C5,C6,
C7,C8,D5,
D6,D7,E5,
E6,E7,F5,
F6,F7,G5,
G6,G7,H2,
H5,H6,H7,J
5,J6,J7,
K5,K6,K7,
L5,L6,L7,
M5,M6,M7,
N4,N8
Ground
Ground for the core of the device
.
CY7C1360B–Pin Definitions
(continued)
Name
TQFP
3-Chip
Enable
TQFP
2-Chip
Enable
BGA
fBGA
I/O
Description
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