參數(shù)資料
型號: CY7C1248V18-333BZI
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)
中文描述: 2M X 18 DDR SRAM, 0.45 ns, PBGA165
封裝: 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
文件頁數(shù): 16/27頁
文件大?。?/td> 1037K
代理商: CY7C1248V18-333BZI
CY7C1246V18
CY7C1257V18
CY7C1248V18
CY7C1250V18
Document Number: 001-06348 Rev. *C
Page 16 of 27
TAP AC Switching Characteristics
Over the Operating Range
[13, 14]
Parameter
t
TCYC
t
TF
t
TH
t
TL
Setup Times
t
TMSS
t
TDIS
t
CS
Hold Times
t
TMSH
t
TDIH
t
CH
Output Times
t
TDOV
t
TDOX
Description
Min
50
Max
Unit
ns
MHz
ns
ns
TCK Clock Cycle Time
TCK Clock Frequency
TCK Clock HIGH
TCK Clock LOW
20
20
20
TMS Setup to TCK Clock Rise
TDI Setup to TCK Clock Rise
Capture Setup to TCK Rise
5
5
5
ns
ns
ns
TMS Hold after TCK Clock Rise
TDI Hold after Clock Rise
Capture Hold after Clock Rise
5
5
5
ns
ns
ns
TCK Clock LOW to TDO Valid
TCK Clock LOW to TDO Invalid
10
ns
ns
0
TAP Timing and Test Conditions
Figure 2
shows the TAP timing and test conditions.
[14]
Figure 2. TAP Timing and Test Conditions
0.9V
t
TL
t
TH
(a)
TDO
C
L
= 20 pF
Z
0
= 50
GND
50
1.8V
0V
ALL INPUT PULSES
0.9V
Test Clock
TCK
Test Mode Select
TMS
Test Data In
TDI
Test Data Out
TDO
t
TCYC
t
TMSH
t
TMSS
t
TDIS
t
TDIH
t
TDOV
t
TDOX
Notes
13.t
and t
refer to the setup and hold time requirements of latching data from the boundary scan register.
14.Test conditions are specified using the load in TAP AC Test Conditions. t
R
/t
F
= 1 ns.
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相關(guān)PDF資料
PDF描述
CY7C1248V18-333BZXC 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)
CY7C1248V18-333BZXI 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)
CY7C1248V18-375BZC 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)
CY7C1248V18-375BZI 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)
CY7C1248V18-375BZXC 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)
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