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參數(shù)資料
| 型號： | CY7C1246V18-300BZC |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | DRAM |
| 英文描述： | 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency) |
| 中文描述： | 4M X 8 DDR SRAM, 0.45 ns, PBGA165 |
| 封裝： | 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 |
| 文件頁數(shù)： | 7/27頁 |
| 文件大?。?/td> | 1037K |
| 代理商： | CY7C1246V18-300BZC |
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CY7C1246V18
CY7C1257V18
CY7C1248V18
CY7C1250V18
Document Number: 001-06348 Rev. *C
Page 7 of 27
ZQ
Input
Output Impedance Matching Input
. This input is used to tune the device outputs to the system
data bus impedance. CQ, CQ, and Q
[x:0]
output impedance are set to 0.2 x RQ, where RQ is a
resistor connected between ZQ and ground. Alternatively, this pin can be connected directly to
V
DDQ
, which enables the minimum impedance mode. This pin cannot be connected directly to
GND or left unconnected.
DOFF
Input
DLL Turn Off, Active LOW
. Connecting this pin to ground turns off the DLL inside the device.
The timing in the DLL turned off operation is different from that listed in this data sheet. For
normal operation, this pin can be connected to a pull up through a 10 Kohm or less pull up
resistor. The device behaves in DDR-I mode when the DLL is turned off. In this mode, the device
can be operated at a frequency of up to 167 MHz with DDR-I timing.
TDO
Output
TDO for JTAG
.
TCK
Input
TCK pin for JTAG
.
TDI
Input
TDI pin for JTAG
.
TMS
Input
TMS pin for JTAG
.
NC
N/A
Not connected to the die
. Can be tied to any voltage level.
NC/72M
N/A
Not connected to the die
. Can be tied to any voltage level.
NC/144M
N/A
Not connected to the die
. Can be tied to any voltage level.
NC/288M
N/A
Not connected to the die
. Can be tied to any voltage level.
V
REF
Input-
Reference
Reference Voltage Input
. Static input used to set the reference level for HSTL inputs, outputs,
and AC measurement points.
V
DD
Power Supply
Power supply inputs to the core of the device
.
V
SS
Ground
Ground for the device
.
V
DDQ
Power Supply
Power supply inputs for the outputs of the device
.
Pin Definitions
(continued)
Pin Name
IO
Pin Description
[+] Feedback
相關PDF資料 |
PDF描述 |
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| CY7C1246V18-300BZI | 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency) |
| CY7C1246V18-300BZXC | 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency) |
| CY7C1246V18-300BZXI | 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency) |
| CY7C1246V18-333BZC | 36-Mbit DDR-II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency) |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| CY7C12481KV18-400BZC | 功能描述:靜態(tài)隨機存取存儲器 2M X 18 400MHz DDR II+ 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C12481KV18-400BZXC | 功能描述:IC SRAM 36MBIT 400MHZ 165-FPBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:150 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應商設備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF) |
| CY7C1248KV18-400BZC | 功能描述:靜態(tài)隨機存取存儲器 36MB (2Mx18) 1.8v 400MHz DDR II 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1248KV18-400BZXC | 功能描述:靜態(tài)隨機存取存儲器 36MB (2Mx18) 1.8v 400MHz DDR II 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| CY7C1248KV18-450BZXC | 功能描述:靜態(tài)隨機存取存儲器 36MB (2Mx18) 1.8v 450MHz DDR II 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
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