參數(shù)資料
型號： CY7C0851V-133AC
廠商： CYPRESS SEMICONDUCTOR CORP
元件分類： DRAM
英文描述： FLEx36TM 3.3V 32K/64K/128K/256K x 36 Synchronous Dual-Port RAM
中文描述： 64K X 36 DUAL-PORT SRAM, 4.4 ns, PQFP176
封裝： 24 X 24 MM, 1.40 MM HEIGHT, TQFP-176
文件頁數(shù)： 26/29頁
文件大小： 764K
代理商： CY7C0851V-133AC
CY7C0850V/CY7C0851V
CY7C0852V/CY7C0853V
Document #: 38-06070 Rev. *D
Page 26 of 29
Ordering Information
256K
×
36 (9M) 3.3V Synchronous CY7C0853V Dual-Port SRAM
Speed
(MHz)
Ordering Code
133
CY7C0853V-133BBC
CY7C0853V-133BBI
100
CY7C0853V-100BBC
CY7C0853V-100BBI
128K
×
36 (4M) 3.3V Synchronous CY7C0852V Dual-Port SRAM
Speed
(MHz)
Ordering Code
167
CY7C0852V-167BBC
CY7C0852V-167AC
133
CY7C0852V-133BBC
CY7C0852V-133BBI
CY7C0852V-133AC
CY7C0852V-133AI
64K
×
36 (2M) 3.3V Synchronous CY7C0851V Dual-Port SRAM
Speed
(MHz)
Ordering Code
167
CY7C0851V-167BBC
CY7C0851V-167AC
133
CY7C0851V-133BBC
CY7C0851V-133BBI
CY7C0851V-133AC
CY7C0851V-133AI
32K
×
36 (1M) 3.3V Synchronous CY7C0850V Dual-Port SRAM
Speed
(MHz)
Ordering Code
167
CY7C0850V-167BBC
CY7C0850V-167AC
133
CY7C0850V-133BBC
CY7C0850V-133BBI
CY7C0850V-133AC
CY7C0850V-133AI
Package
Name
BB172
BB172
BB172
BB172
Package Type
Operating
Range
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
Package
Name
BB172
A176
BB172
BB172
A176
A176
Package Type
Operating
Range
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
176-pin Flat Pack 24 mm × 24 mm (TQFP)
Commercial
Commercial
Industrial
Package
Name
BB172
A176
BB172
BB172
A176
A176
Package Type
Operating
Range
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
176-pin Flat Pack 24 mm × 24 mm (TQFP)
Commercial
Commercial
Industrial
Package
Name
BB172
A176
BB172
BB172
A176
A176
Package Type
Operating
Range
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Commercial
172-ball Grid Array 15 mm × 15 mm with 1.0 mm pitch (BGA)
Industrial
176-pin Flat Pack 24 mm × 24 mm (TQFP)
176-pin Flat Pack 24 mm × 24 mm (TQFP)
Commercial
Commercial
Industrial
相關(guān)PDF資料
PDF描述
CY7C0851V-133AI CONNECTOR ACCESSORY
CY7C0851V-133BBC CONNECTOR ACCESSORY
CY7C0851V-133BBI CONNECTOR ACCESSORY
CY7C0851V-167AC CONNECTOR ACCESSORY
CY7C0851V-167BBC CONNECTOR ACCESSORY
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C0851V-133AXC 功能描述:IC SRAM 2MBIT 133MHZ 176LQFP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2
CY7C0851V-133AXCT 功能描述:IC SRAM 2MBIT 133MHZ 176LQFP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:1,000 系列:- 格式 - 存儲器:RAM 存儲器類型:移動 SDRAM 存儲容量:256M（8Mx32） 速度:133MHz 接口:并聯(lián) 電源電壓:1.7 V ~ 1.95 V 工作溫度:-40°C ~ 85°C 封裝/外殼:90-VFBGA 供應(yīng)商設(shè)備封裝:90-VFBGA（8x13） 包裝:帶卷 (TR) 其它名稱:557-1327-2
CY7C0851V-133BBC 制造商:Rochester Electronics LLC 功能描述:64K X 36 SYNC DPSRAM - Bulk 制造商:Cypress Semiconductor 功能描述:SRAM Chip Sync Dual 3.3V 2.25M-Bit 64K x 36 4.4ns 172-Pin FBGA
CY7C0851V-133BBI 制造商:Cypress Semiconductor 功能描述: 制造商:Rochester Electronics LLC 功能描述:64K X 36 SYNC DPSRAM INDUSTRAIL TEMP - Bulk
CY7C0851V-150BBC 制造商:Cypress Semiconductor 功能描述:SRAM Chip Sync Dual 3.3V 2M-Bit 64K x 36 4ns 172-Pin FBGA 制造商:Rochester Electronics LLC 功能描述:- Bulk
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