參數(shù)資料
型號: CY74FCT823BTPC
廠商: Texas Instruments
文件頁數(shù): 13/15頁
文件大小: 0K
描述: IC 9BIT BUS INT F-F 3ST 24-DIP
標(biāo)準(zhǔn)包裝: 600
系列: 74FCT
功能: 主復(fù)位
類型: D 型總線
輸出類型: 三態(tài)非反相
元件數(shù): 1
每個元件的位元數(shù): 9
延遲時間 - 傳輸: 6ns
觸發(fā)器類型: 正邊沿
輸出電流高,低: 32mA,64mA
電源電壓: 4.75 V ~ 5.25 V
工作溫度: -40°C ~ 85°C
安裝類型: 通孔
封裝/外殼: 24-DIP(0.300",7.62mm)
包裝: 管件
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
CY74FCT823ATPC
OBSOLETE
PDIP
NT
24
TBD
Call TI
-40 to 85
CY74FCT823ATPC
CY74FCT823ATPCE4
OBSOLETE
PDIP
NT
24
TBD
Call TI
-40 to 85
CY74FCT823ATQCT
ACTIVE
SSOP
DBQ
24
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
FCT823A
CY74FCT823ATQCTG4
ACTIVE
SSOP
DBQ
24
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
FCT823A
CY74FCT823ATSOC
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT823A
CY74FCT823ATSOCE4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT823A
CY74FCT823ATSOCG4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT823A
CY74FCT823CTSOC
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT823C
CY74FCT823CTSOCE4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT823C
CY74FCT823CTSOCG4
ACTIVE
SOIC
DW
24
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
FCT823C
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
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